Failure analysis and reliability improvement of small turbine engine blades

1992 ◽  
Vol 42 (5) ◽  
pp. 841-852 ◽  
Author(s):  
H.K. Shee ◽  
H.Y. Chen ◽  
T.W. Yang
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


2014 ◽  
Vol 14 (5) ◽  
pp. 578-587 ◽  
Author(s):  
R. K. Mishra ◽  
Johney Thomas ◽  
K. Srinivasan ◽  
Vaishakhi Nandi ◽  
Raghavendra Bhat

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