Effect of distribution of grain boundary diffusivity on plastic flow of austenitic steel II: The role of dislocation annihilation in grain boundaries in the plastic flow of polycrystalline materials

1988 ◽  
Vol 100 ◽  
pp. 93-100 ◽  
Author(s):  
W.A. Swiatnicki ◽  
M.W. Grabski
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Austenitic Steel ◽  
Plastic Flow ◽  
Polycrystalline Materials ◽  
Dislocation Annihilation ◽  
Boundary Diffusivity

Atomistic Modeling of Grain Boundaries and Dislocation Processes in Metallic Polycrystalline Materials

2009 ◽  
Vol 131 (4) ◽  
Author(s):  
Douglas E. Spearot ◽  
David L. McDowell
Keyword(s):  
Plastic Deformation ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Boundary Behavior ◽  
Complex Stress ◽  
Boundary Structure ◽  
Polycrystalline Materials ◽  
Atomistic Modeling ◽  
Triple Junctions

The objective of this review article is to provide a concise discussion of atomistic modeling efforts aimed at understanding the nanoscale behavior and the role of grain boundaries in plasticity of metallic polycrystalline materials. Atomistic simulations of grain boundary behavior during plastic deformation have focused mainly on three distinct configurations: (i) bicrystal models, (ii) columnar nanocrystalline models, and (iii) 3D nanocrystalline models. Bicrystal models facilitate the isolation of specific mechanisms that occur at the grain boundary during plastic deformation, whereas columnar and 3D nanocrystalline models allow for an evaluation of triple junctions and complex stress states characteristic of polycrystalline microstructures. Ultimately, both sets of calculations have merits and are necessary to determine the role of grain boundary structure on material properties. Future directions in grain boundary modeling are discussed, including studies focused on the role of grain boundary impurities and issues related to linking grain boundary mechanisms observed via atomistic simulation with continuum models of grain boundary plasticity.

scholarly journals Emission of Dislocations from Grain Boundaries and Its Role in Nanomaterials

Crystals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 41
Author(s):  
James C. M. Li ◽  
C. R. Feng ◽  
Bhakta B. Rath
Keyword(s):  
Electron Microscopy ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Polycrystalline Materials ◽  
Supporting Evidence ◽  
Petch Relation ◽  
Direct Observations ◽  
Transmission Electron ◽  
Alternate Mechanism

The Frank-Read model, as a way of generating dislocations in metals and alloys, is widely accepted. In the early 1960s, Li proposed an alternate mechanism. Namely, grain boundary sources for dislocations, with the aim of providing a different model for the Hall-Petch relation without the need of dislocation pile-ups at grain boundaries, or Frank-Read sources inside the grain. This article provides a review of his model, and supporting evidence for grain boundaries or interfacial sources of dislocations, including direct observations using transmission electron microscopy. The Li model has acquired new interest with the recent development of nanomaterial and multilayers. It is now known that nanocrystalline metals/alloys show a behavior different from conventional polycrystalline materials. The role of grain boundary sources in nanomaterials is reviewed briefly.

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal

2018 ◽  
Author(s):  
Guoxiong Zheng ◽  
Yifan Luo ◽  
Hideo Miura
Keyword(s):  
Thin Film ◽  
Grain Boundary ◽  
Tensile Test ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Semiconductor Devices ◽  
Ebsd Analysis ◽  
Structural Defects ◽  
Polycrystalline Materials ◽  
Transgranular Fracture

Various brittle fractures have been found to occur at grain boundaries in polycrystalline materials. In thin film interconnections used for semiconductor devices, open failures caused by electro- and strain-induced migrations have been found to be dominated by porous random grain boundaries that consist of a lot of defects. Therefore, it is very important to explicate the dominant factors of the strength of a grain boundary in polycrystalline materials for assuring the safe and reliable operation of various products. In this study, both electron back-scatter diffraction (EBSD) analysis and a micro tensile test in a scanning electron microscope was applied to copper thin film which is used for interconnection of semiconductor devices in order to clarify the relationship between the strength and the crystallinity of a grain and a grain boundary quantitatively. Image quality (IQ) value obtained from the EBSD analysis, which indicates the average sharpness of the diffraction pattern (Kikuchi pattern) was applied to the crystallinity analysis. This IQ value indicates the total density of defects such as vacancies, dislocations, impurities, and local strain, in other words, the order of atom arrangement in the observed area in nano-scale. In the micro tensile test system, stress-strain curves of a single crystal specimen and a bicrystal specimen was measured quantitatively. Both transgranular and intergranular fracture modes were observed in the tested specimens with different IQ values. Based to the results of these experiments, it was found that there is the critical IQ value at which the fracture mode of the bicrystal specimen changes from brittle intergranular fracture at a grain boundary to ductile transgranular fracture in a grain. The strength of a grain boundary increases monotonically with IQ value because of the increase in the total number of rigid atomic bonding. On the other hand, the strength of a grain decreases monotonically with the increase of IQ value because the increase in the order of atom arrangement accelerates the movement of dislocations. Finally, it was clarified that the strength of a grain boundary and a grain changes drastically as a strong function of their crystallinity.

Mechanisms of ductility improvement in L12 compounds

1988 ◽  
Vol 3 (3) ◽  
pp. 426-440 ◽  
Author(s):  
Osamu Izumi ◽  
Takayuki Takasugi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intermetallic Compounds ◽  
Present Article ◽  
Electronic Structures ◽  
Alloying Effect ◽  
Test Environment ◽  
Materials Development

The present article first describes some characteristics of structure, chemistry, and electronic (bond) nature for grain boundaries in the A3B Li2-type intermetallic compounds. Next, the phenomenological aspects for the grain boundary brittleness of the Li2-type intermetallic compounds are reviewed with respect to the combination of the constituent atoms, the alloying effect, the stoichiometry effect, and a role of impurity or gaseous atoms. It is emphasized that the brittleness of grain boundaries in the intermetallic compounds is directly controlled by the atomistic and electronic structures at grain boundary regions. Based on these systematic investigations, it is suggested that the brittleness of the Li2-type intermetallic compounds can be manipulated by appropriate control of composition and the corresponding electrochemical bond environment at grain boundary planes and by control of test environment. Furthermore, some examples of the materials development are described.

The Influence of the Exterior Surface on Grain Boundary Mobility Measurements

2014 ◽  
Vol 95 ◽  
pp. 56-65
Author(s):  
Amy Novick-Cohen ◽  
Anna Zigelman ◽  
Arkady Vilenkin
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Mean Curvature ◽  
Boundary Energy ◽  
Polycrystalline Materials ◽  
Normal Velocity ◽  
Exterior Surface ◽  
Mean Curvature Motion ◽  
Curvature Motion ◽  
Half Loop

Polycrystalline materials typically contain a very large number of grains whose surrounding grain boundaries evolve over time to reducethe overall energy of the microstructure. The evolution of the microstructure is influencedby the motion of the exterior surface since the grain boundaries couple to the exterior surface of the specimen; these effects can be appreciable especially in thin specimens. We model these effects using the classical framework of Mullins, in whichgrain boundaries move by mean curvature motion, Vn =A κ, and the exterior surface evolves by surface diffusion, Vn = -BΔs κ. Here Vn and κ denote the normal velocity and the mean curvature of the respective evolving surfaces, and Δs is the surface Laplacian. A classical way to determine A, the ``reduced mobility," is to make measurements based on the half-loop bicrystalline geometry. In this geometry one of the two grains, which embedded within the other, recedes at a roughly constant rate which can provide an estimate for A. In this note, we report on findings concerning the effects of the exterior surface on grain boundary motion and mobility measurements in the context of the half-loop bicrystalline geometry. We assume that the ratio of grain boundary energy to the exterior surface energy is small, and suitable assumptions are made of the specimen aspect ratio.

Anisotropic Behaviour of Grain Boundaries

2005 ◽  
Vol 482 ◽  
pp. 63-70 ◽  
Author(s):  
Václav Paidar ◽  
Pavel Lejček
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Polycrystalline Materials ◽  
Grain Boundary Engineering ◽  
Interfacial Dislocation ◽  
Special Character ◽  
Boundary Properties ◽  
Properties Of Materials ◽  
Boundary Classification ◽  
Boundary Chemistry

Grain boundaries are decisive for many properties of materials. Due to short-range stress field their influence is primarily based on their atomic structure. Special character of grain boundary properties related to their structure, follows from the nature of atomic arrangements in the boundary cores, from the interfacial dislocation content and from the boundary mobility. All those aspects of boundary behaviour are strongly influenced by the boundary chemistry including various segregation phenomena. Approaches to the boundary classification and the interpretation of recent experimental results are discussed in the context of the complex relationship between microstructure and material properties. Such findings are essential for Grain Boundary Engineering proposed to improve the performance of polycrystalline materials.

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