The Influence of the Exterior Surface on Grain Boundary Mobility Measurements

2014 ◽  
Vol 95 ◽  
pp. 56-65
Author(s):  
Amy Novick-Cohen ◽  
Anna Zigelman ◽  
Arkady Vilenkin

Polycrystalline materials typically contain a very large number of grains whose surrounding grain boundaries evolve over time to reducethe overall energy of the microstructure. The evolution of the microstructure is influencedby the motion of the exterior surface since the grain boundaries couple to the exterior surface of the specimen; these effects can be appreciable especially in thin specimens. We model these effects using the classical framework of Mullins, in whichgrain boundaries move by mean curvature motion, Vn =A κ, and the exterior surface evolves by surface diffusion, Vn = -BΔs κ. Here Vn and κ denote the normal velocity and the mean curvature of the respective evolving surfaces, and Δs is the surface Laplacian. A classical way to determine A, the ``reduced mobility," is to make measurements based on the half-loop bicrystalline geometry. In this geometry one of the two grains, which embedded within the other, recedes at a roughly constant rate which can provide an estimate for A. In this note, we report on findings concerning the effects of the exterior surface on grain boundary motion and mobility measurements in the context of the half-loop bicrystalline geometry. We assume that the ratio of grain boundary energy to the exterior surface energy is small, and suitable assumptions are made of the specimen aspect ratio.

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4219
Author(s):  
Sebastian Florez ◽  
Julien Fausty ◽  
Karen Alvarado ◽  
Brayan Murgas ◽  
Marc Bernacki

Grain growth is a well-known and complex phenomenon occurring during annealing of all polycrystalline materials. Its numerical modeling is a complex task when anisotropy sources such as grain orientation and grain boundary inclination have to be taken into account. This article presents the application of a front-tracking methodology to the context of anisotropic grain boundary motion at the mesoscopic scale. The new formulation of boundary migration can take into account any source of anisotropy both at grain boundaries as well as at multiple junctions (MJs) (intersection point of three or more grain boundaries). Special attention is given to the decomposition of high-order MJs for which an algorithm is proposed based on local grain boundary energy minimisation. Numerical tests are provided using highly heterogeneous configurations, and comparisons with a recently developed Finite-Element Level-Set (FE-LS) approach are given. Finally, the computational performance of the model will be studied comparing the CPU-times obtained with the same model but in an isotropic context.


Author(s):  
R. W. Fonda ◽  
D. E. Luzzi

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.


2014 ◽  
Vol 783-786 ◽  
pp. 1634-1639
Author(s):  
Dmitri A. Molodov ◽  
Jann Erik Brandenburg ◽  
Luis Antonio Barrales-Mora ◽  
Günter Gottstein

The faceting and migration behavior of low angle <100> grain boundaries in high purity aluminum bicrystals was investigated. In-situ technique based on orientation contrast imaging was applied. In contrast to the pure tilt boundaries, which remained straight/flat and immobile during annealing at elevated temperatures, mixed tilt-twist boundaries readily assumed a curved shape and steadily moved under the capillary force. Computational analysis revealed that this behavior is due to the inclinational anisotropy of grain boundary energy, which in turn depends on boundary geometry – the energy of pure tilt low angle <100> boundaries is anisotropic, whereas that of mixed tilt-twist boundaries isotropic with respect to boundary inclination.


1972 ◽  
Vol 11 (62) ◽  
pp. 265-277 ◽  
Author(s):  
Shigenao Suzuki ◽  
Daisuke Kuroiwa

Abstract Relative grain-boundary energies in ice were measured as a function of mismatch angles made by the c-axes or a-axes in grains, using ice specimens having triple grain boundaries. It was found that the Read–Shockley equation for grain-boundary energy was valid for grain boundaries tilted between 0° and 15°. Angles of the solid–vapour grain-boundary groove in ice were measured by the use of micro-interferometry at grain-boundary grooves covered with extremely thin metalic foil. The data were compared with those measured by a silvered replica of grain-boundary grooves.


Author(s):  
Guoxiong Zheng ◽  
Yifan Luo ◽  
Hideo Miura

Various brittle fractures have been found to occur at grain boundaries in polycrystalline materials. In thin film interconnections used for semiconductor devices, open failures caused by electro- and strain-induced migrations have been found to be dominated by porous random grain boundaries that consist of a lot of defects. Therefore, it is very important to explicate the dominant factors of the strength of a grain boundary in polycrystalline materials for assuring the safe and reliable operation of various products. In this study, both electron back-scatter diffraction (EBSD) analysis and a micro tensile test in a scanning electron microscope was applied to copper thin film which is used for interconnection of semiconductor devices in order to clarify the relationship between the strength and the crystallinity of a grain and a grain boundary quantitatively. Image quality (IQ) value obtained from the EBSD analysis, which indicates the average sharpness of the diffraction pattern (Kikuchi pattern) was applied to the crystallinity analysis. This IQ value indicates the total density of defects such as vacancies, dislocations, impurities, and local strain, in other words, the order of atom arrangement in the observed area in nano-scale. In the micro tensile test system, stress-strain curves of a single crystal specimen and a bicrystal specimen was measured quantitatively. Both transgranular and intergranular fracture modes were observed in the tested specimens with different IQ values. Based to the results of these experiments, it was found that there is the critical IQ value at which the fracture mode of the bicrystal specimen changes from brittle intergranular fracture at a grain boundary to ductile transgranular fracture in a grain. The strength of a grain boundary increases monotonically with IQ value because of the increase in the total number of rigid atomic bonding. On the other hand, the strength of a grain decreases monotonically with the increase of IQ value because the increase in the order of atom arrangement accelerates the movement of dislocations. Finally, it was clarified that the strength of a grain boundary and a grain changes drastically as a strong function of their crystallinity.


2012 ◽  
Vol 715-716 ◽  
pp. 179-179
Author(s):  
David L. Olmsted ◽  
Elizabeth A. Holm ◽  
Stephen M. Foiles

Grain boundary properties depend on both composition and structure. To test the relative contributions of composition and structure to the grain boundary energy, we calculated the energy of 388 grain boundaries in four elemental, fcc metals: Ni, Al, Au and Cu. We constructed atomic-scale bicrystals of each boundary and subjected them to a rigorous energy minimization process to determine the lowest energy structure. Typically, several thousand boundary configurations were examined for each boundary in each element.


2013 ◽  
Vol 68 (12) ◽  
pp. 980-983 ◽  
Author(s):  
J.-E. Brandenburg ◽  
L.A. Barrales-Mora ◽  
D.A. Molodov ◽  
G. Gottstein

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