Three-dimensional integrated circuit: technology and application prospect

Microelectronics Journal ◽

10.1016/0026-2692(89)90125-0 ◽

1989 ◽

Vol 20 (1-2) ◽

pp. 105-112 ◽

Author(s):

Yoichi Akasaka

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005. ◽

10.1109/isscc.2005.1494016 ◽

2005 ◽

Author(s):

V. Suntharalingam ◽

R. Berger ◽

J.A. Burns ◽

C.K. Chen ◽

C.L. Keast ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Cmos Image Sensor ◽

Image Sensor ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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Three-dimensional integrated circuit: technology and application prospect

Microelectronics Reliability ◽

10.1016/0026-2714(90)90516-p ◽

1990 ◽

Vol 30 (3) ◽

pp. 624

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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An SOI-based three-dimensional integrated circuit technology

2000 IEEE International SOI Conference. Proceedings (Cat. No.00CH37125) ◽

10.1109/soi.2000.892749 ◽

2002 ◽

Author(s):

J. Burns ◽

L. McIlrath ◽

J. Hopwood ◽

C. Keast ◽

D.P. Vu ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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SOI-enabled three-dimensional integrated-circuit technology

2010 IEEE International SOI Conference (SOI) ◽

10.1109/soi.2010.5641367 ◽

2010 ◽

Author(s):

C.K. Chen ◽

B. Wheeler ◽

D.R.W. Yost ◽

J.M. Knecht ◽

C.L. Chen ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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Three Dimensional Integrated Circuit Design

10.1007/978-1-4419-0784-4 ◽

2010 ◽

Keyword(s):

Circuit Design ◽

Integrated Circuit ◽

Three Dimensional ◽

Integrated Circuit Design ◽

Three Dimensional Integrated Circuit

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Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

Journal of Electronic Materials ◽

10.1007/s11664-013-2840-4 ◽

2013 ◽

Vol 43 (1) ◽

pp. 236-246 ◽

Author(s):

Hao Hsu ◽

Tzu-Yang Lin ◽

Fan-Yi Ouyang

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit

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Transient Simulations of Three-dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume approach

32nd Design Automation Conference ◽

10.1109/dac.1995.249996 ◽

1995 ◽

Author(s):

Mike Chou

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Transient Simulations ◽

Three Dimensional Integrated Circuit

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Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Materials Letters ◽

10.1016/j.matlet.2013.07.078 ◽

2013 ◽

Vol 110 ◽

pp. 13-15 ◽

Author(s):

Y.J. Chen ◽

T.L. Yang ◽

J.J. Yu ◽

C.L. Kao ◽

C.R. Kao

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit

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Through-silicon via technology for three-dimensional integrated circuit manufacturing

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521827 ◽

2012 ◽

Author(s):

Yann Civale ◽

Augusto Redolfi ◽

Patrick Jaenen ◽

Maarten Kostermans ◽

Els Van Besien ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Through Silicon Via ◽

Integrated Circuit Manufacturing ◽

Three Dimensional Integrated Circuit

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System level performance evaluation of three-dimensional integrated circuit

2011 9th IEEE International Conference on ASIC ◽

10.1109/asicon.2011.6157300 ◽

2011 ◽

Author(s):

Libo Qian ◽

Zhangming Zhu ◽

Yintang Yang

Keyword(s):

Performance Evaluation ◽

Integrated Circuit ◽

Three Dimensional ◽

System Level ◽

Three Dimensional Integrated Circuit ◽

Level Performance

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