2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications

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Published By IEEE

9781467343862, 9781467343848, 9781467343862

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521765 ◽

2012 ◽

Author(s):

Iziana Yahya ◽

Noor Asikin Ab Ghani ◽

Mohd Arif Anuar Mohd Salleh ◽

Hamidi Abd Hamid ◽

Zainal Ariffin Ahmad ◽

...

Keyword(s):

Thermal Aging ◽

Copper Substrate ◽

Lead Free ◽

Lead Free Solder ◽

Long Time ◽

Free Solder

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Reliable ultra-low-loop bonding approach on X2/X3 thin QFN

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521768 ◽

2012 ◽

Cited By ~ 1

Author(s):

SH Liew ◽

WL Law

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A cost effective method to test RF power on the ATE in manufacturing

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521755 ◽

2012 ◽

Author(s):

Chek Yean Feng

Keyword(s):

Cost Effective ◽

Rf Power ◽

Cost Effective Method

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Sintering of Ag80-Al20 nanoalloy for high temperature die attach applications on silicon carbide-based power devices: The effects of ramp rate and dwell time

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521743 ◽

2012 ◽

Cited By ~ 1

Author(s):

Vemal Raja Manikam ◽

Khairunisak Abdul Razak ◽

Kuan Yew Cheong

Keyword(s):

Silicon Carbide ◽

High Temperature ◽

Dwell Time ◽

Power Devices ◽

Ramp Rate ◽

Die Attach

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Elimination of epoxy bridging in diebond process

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521796 ◽

2012 ◽

Author(s):

Novin Yap ◽

Caloy Hermosura ◽

Freddie Pascual

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Through-silicon via technology for three-dimensional integrated circuit manufacturing

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521827 ◽

2012 ◽

Cited By ~ 3

Author(s):

Yann Civale ◽

Augusto Redolfi ◽

Patrick Jaenen ◽

Maarten Kostermans ◽

Els Van Besien ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Through Silicon Via ◽

Integrated Circuit Manufacturing ◽

Three Dimensional Integrated Circuit

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Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521835 ◽

2012 ◽

Author(s):

Thomas Oppert ◽

Thorsten Teutsch ◽

Ghassem Azdasht ◽

Elke Zakel

Keyword(s):

Wafer Level

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Sensitivity study of channel termination on vertical side-chip interconnection

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521778 ◽

2012 ◽

Author(s):

Jackson Kong ◽

Bok Eng Cheah ◽

Ai Heong Tan

Keyword(s):

Sensitivity Study ◽

Vertical Side

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Material analysis and process characterization of super high thermal performance die attach epoxy towards package reliability, thermal and electrical performance

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521749 ◽

2012 ◽

Cited By ~ 1

Author(s):

H.T Wang ◽

K.B. Yeo

Keyword(s):

Thermal Performance ◽

Electrical Performance ◽

Material Analysis ◽

Die Attach ◽

Process Characterization ◽

Package Reliability

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Patterning of multi-leveled microstructures on flexible polymer substrate using roll-to-roll ultraviolet nanoimprint lithography

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521804 ◽

2012 ◽

Cited By ~ 1

Author(s):

Nazrin Kooy ◽

Norian Rahman ◽

Khairudin Mohamed

Keyword(s):

Nanoimprint Lithography ◽

Polymer Substrate ◽

Roll To Roll ◽

Flexible Polymer ◽

Flexible Polymer Substrate

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)

Reliable ultra-low-loop bonding approach on X2/X3 thin QFN

A cost effective method to test RF power on the ATE in manufacturing

Sintering of Ag80-Al20 nanoalloy for high temperature die attach applications on silicon carbide-based power devices: The effects of ramp rate and dwell time

Elimination of epoxy bridging in diebond process

Through-silicon via technology for three-dimensional integrated circuit manufacturing

Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

Sensitivity study of channel termination on vertical side-chip interconnection

Material analysis and process characterization of super high thermal performance die attach epoxy towards package reliability, thermal and electrical performance

Patterning of multi-leveled microstructures on flexible polymer substrate using roll-to-roll ultraviolet nanoimprint lithography

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Latest Publications