Transient Simulations of Three-dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume approach

32nd Design Automation Conference ◽

10.1109/dac.1995.249996 ◽

1995 ◽

Author(s):

Mike Chou

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Transient Simulations ◽

Three Dimensional Integrated Circuit

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A multipole-accelerated boundary-element approach to transient simulations of three-dimensional integrated circuit interconnect

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.1994.594078 ◽

2002 ◽

Author(s):

M. Chou ◽

J.K. White

Keyword(s):

Boundary Element ◽

Integrated Circuit ◽

Three Dimensional ◽

Transient Simulations ◽

Element Approach ◽

Three Dimensional Integrated Circuit

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Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach

Proceedings of the 32nd ACM/IEEE conference on Design automation conference - DAC '95 ◽

10.1145/217474.217575 ◽

1995 ◽

Author(s):

Mike Chou ◽

Tom Korsmeyer ◽

Jacob White

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Transient Simulations ◽

Three Dimensional Integrated Circuit

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Three Dimensional Integrated Circuit Design

10.1007/978-1-4419-0784-4 ◽

2010 ◽

Keyword(s):

Circuit Design ◽

Integrated Circuit ◽

Three Dimensional ◽

Integrated Circuit Design ◽

Three Dimensional Integrated Circuit

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Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

Journal of Electronic Materials ◽

10.1007/s11664-013-2840-4 ◽

2013 ◽

Vol 43 (1) ◽

pp. 236-246 ◽

Author(s):

Hao Hsu ◽

Tzu-Yang Lin ◽

Fan-Yi Ouyang

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit

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Three-dimensional integrated circuit: technology and application prospect

Microelectronics Journal ◽

10.1016/0026-2692(89)90125-0 ◽

1989 ◽

Vol 20 (1-2) ◽

pp. 105-112 ◽

Author(s):

Yoichi Akasaka

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit ◽

Circuit Technology

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Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Materials Letters ◽

10.1016/j.matlet.2013.07.078 ◽

2013 ◽

Vol 110 ◽

pp. 13-15 ◽

Author(s):

Y.J. Chen ◽

T.L. Yang ◽

J.J. Yu ◽

C.L. Kao ◽

C.R. Kao

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Three Dimensional Integrated Circuit

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Through-silicon via technology for three-dimensional integrated circuit manufacturing

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2012.6521827 ◽

2012 ◽

Author(s):

Yann Civale ◽

Augusto Redolfi ◽

Patrick Jaenen ◽

Maarten Kostermans ◽

Els Van Besien ◽

...

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Through Silicon Via ◽

Integrated Circuit Manufacturing ◽

Three Dimensional Integrated Circuit

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System level performance evaluation of three-dimensional integrated circuit

2011 9th IEEE International Conference on ASIC ◽

10.1109/asicon.2011.6157300 ◽

2011 ◽

Author(s):

Libo Qian ◽

Zhangming Zhu ◽

Yintang Yang

Keyword(s):

Performance Evaluation ◽

Integrated Circuit ◽

Three Dimensional ◽

System Level ◽

Three Dimensional Integrated Circuit ◽

Level Performance

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Self-Convectional Three-Dimensional Integrated Circuit Cooling System using Micro Flat Heat Pipe for Portable Devices

Heat Transfer Engineering ◽

10.1080/01457632.2014.859514 ◽

2013 ◽

Vol 35 (10) ◽

pp. 924-932 ◽

Author(s):

Namjae Kim ◽

Shiho Kim

Keyword(s):

Heat Pipe ◽

Integrated Circuit ◽

Cooling System ◽

Three Dimensional ◽

Portable Devices ◽

Three Dimensional Integrated Circuit ◽

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Assembly technology development and failure analysis for three-dimensional integrated circuit integration with ultra-thin chip stacking

Microelectronic Engineering ◽

10.1016/j.mee.2016.01.040 ◽

2016 ◽

Vol 156 ◽

pp. 24-29 ◽

Author(s):

Chang-Chun Lee ◽

Yu-Min Lin ◽

Chia-Ping Hsieh ◽

Yan-Yu Liou ◽

Chau-Jie Zhan ◽

...

Keyword(s):

Failure Analysis ◽

Integrated Circuit ◽

Technology Development ◽

Three Dimensional ◽

Circuit Integration ◽

Assembly Technology ◽

Three Dimensional Integrated Circuit

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