Quality and reliability improvement through defect oriented failure analysis

1996 ◽  
Vol 36 (11-12) ◽  
pp. 1835-1838
Author(s):  
P. de Pauw ◽  
S. van Haeverbeke
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


Author(s):  
Anastasia N. Kastania

E-health evaluation, which involves different dimensions, has increased. In traditional healthcare, quality dimensions exist but these are not sufficiently exploited for e-health. Reliability is often examined regarding technology, software, demand and survival. This chapter reviews the reasons that e-health systems need to be evaluated, the methods followed for conducting e-health evaluation studies and the main points that characterize an evaluation procedure as successful. Many researchers have presented evaluation considerations for e-health. Herein, the emphasis is on analyzing a series of ideas mined from the scientific literature that allows drawing up practical considerations for e-health evaluation. These considerations focus both on quality and reliability assurance as well as on quality and reliability improvement.


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