Three-dimensional coherent transfer function in a reflection-mode confocal scanning microscope

1991 ◽  
Vol 81 (5) ◽  
pp. 281-284 ◽  
Author(s):  
C.J.R. Sheppard ◽  
Min Gu ◽  
X.Q. Mao
1998 ◽  
Vol 4 (1) ◽  
pp. 63-71 ◽  
Author(s):  
Min Gu

Three-dimensional image formation in an interference confocal scanning microscope under ultra-short pulsed beam illumination is investigated in this study. The novelty of this new image system is that it keeps advantages in femtosecond interferometry but also provides a femtosecond-resolved three-dimensional image without necessarily using an ultrafast detector. For a 5-fs pulsed beam illumination, spatial resolution in the axial and transverse directions in this system is improved by approximately 45% and 15%, respectively, compared with that in the case of continuous wave illumination. However, strong chromatic aberration caused by an ultrashort pulsed beam can result in a degradation of spatial and temporal resolution, whereas weak chromatic aberration may lead to an improvement in transverse resolution.


2017 ◽  
Vol 87 (5) ◽  
pp. 766-773 ◽  
Author(s):  
Sara M. Wilson ◽  
Wen Lien ◽  
David P. Lee ◽  
William J. Dunn

ABSTRACT Objective: To see whether there is an advantage to using a self-limiting phosphoric acid etchant versus a traditional 34% phosphoric acid etchant for bonding by measuring the depth of etch at multiple time intervals. Materials and Methods: A total of 25 bovine teeth were mounted and etched on the facial surface with two different etchants: standard 34% phosphoric acid and a self-limiting 35% phosphoric acid etchant at varied time intervals of 15, 30, 60, 90, and 120 seconds. Teeth were scanned using a three-dimensional laser confocal scanning microscope prior to etching and scanned again after etching to determine the depth of enamel etched compared to the baseline enamel surface prior to etching. Results: The 34% phosphoric acid etchant etched significantly deeper than the self-limiting etch. Etch times exceeding 30 seconds also etched significantly deeper for both types of etchant. Conclusion: The etch depth of the self-limiting etchant was consistently less than the standard etchant. Both types of etchant etched deeper after 30 seconds, but the depth of etch at 120 seconds was not different than at 60 seconds, indicating that both etchants are somewhat self-limiting in depth. Therefore, there is no advantage to using the self-limiting etchant.


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