Interdiffusion between the ordered intermetallic compound TiAl and Mo

1995 ◽  
Vol 3 (1) ◽  
pp. 47-56 ◽  
Author(s):  
M.-X. Zhang ◽  
K.-C. Hsieh ◽  
Y.A. Chang ◽  
J.P. Neumann ◽  
A.D. Romig
Keyword(s):  
Intermetallic Compound ◽  
Ordered Intermetallic ◽  
Compound Tial

Dislocation Substructures Produced During Tensile, Creep, and Fatigue Deformation of Ti3Al at 700°C

1977 ◽  
Vol 35 ◽  
pp. 272-273
Author(s):  
S. M. L. Sastry
Keyword(s):  
Intermetallic Compound ◽  
Strain Rate ◽  
Tensile Creep ◽  
Slip Systems ◽  
Slip Vector ◽  
Superlattice Structure ◽  
Slip Activity ◽  
Dislocation Arrangement ◽  
Ordered Intermetallic ◽  
Tangled Dislocation

Ti3Al is an ordered intermetallic compound having the DO19-type superlattice structure. The compound exhibits very limited ductility in tension below 700°C because of a pronounced planarity of slip and the absence of a sufficient number of independent slip systems. Significant differences in slip behavior in the compound as a result of differences in strain rate and mode of deformation are reported here.Figure 1 is a comparison of dislocation substructures in polycrystalline Ti3Al specimens deformed in tension, creep, and fatigue. Slip activity on both the basal and prism planes is observed for each mode of deformation. The dominant slip vector in unidirectional deformation is the a-type (b) = <1120>) (Fig. la). The dislocations are straight, occur for the most part in a screw orientation, and are arranged in planar bands. In contrast, the dislocation distribution in specimens crept at 700°C (Fig. lb) is characterized by a much reduced planarity of slip, a tangled dislocation arrangement instead of planar bands, and an increased incidence of nonbasal slip vectors.

Atomic structure of interface of intermetallic compound TiAl and nitride Ti2AIN using HREM and image processing

1991 ◽  
Vol 49 ◽  
pp. 570-571
Author(s):  
E. Sukedai ◽  
H. Mabuchi ◽  
H. Hashimoto ◽  
Y. Nakayama
Keyword(s):  
Mechanical Properties ◽  
Image Processing ◽  
Composite Material ◽  
Intermetallic Compound ◽  
Side Surface ◽  
High Resolution Electron Microscopy ◽  
Hexagonal Structure ◽  
Second Phase ◽  
Resolution Electron ◽  
Compound Tial

In order to improve the mechanical properties of an intermetal1ic compound TiAl, a composite material of TiAl involving a second phase Ti2AIN was prepared by a new combustion reaction method. It is found that Ti2AIN (hexagonal structure) is a rod shape as shown in Fig.1 and its side surface is almost parallel to the basal plane, and this composite material has distinguished strength at elevated temperature and considerable toughness at room temperature comparing with TiAl single phase material. Since the property of the interface of composite materials has strong influences to their mechanical properties, the structure of the interface of intermetallic compound and nitride on the areas corresponding to 2, 3 and 4 as shown in Fig.1 was investigated using high resolution electron microscopy and image processing.

Characteristics of the nitrogen ion implanted intermetallic compound TiAl

1993 ◽  
Vol 80-81 ◽  
pp. 250-253 ◽  
Author(s):  
Wang Xi ◽  
Yang Yunjie ◽  
Liu Xianghuai ◽  
Zou Shichang ◽  
Shigeji Tanaguchi ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Nitrogen Ion ◽  
Compound Tial ◽  
Ion Implanted

Anelastic relaxation behavior of hydrogen in L12 ordered intermetallic compound Ni3Al

2002 ◽  
Vol 47 (9) ◽  
pp. 625-629 ◽  
Author(s):  
C.B. Jiang ◽  
H. Li ◽  
C.X. Huang ◽  
G.Y. Li ◽  
S.D. Wu ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Relaxation Behavior ◽  
Ordered Intermetallic

Effect of grain size and temperature on the yield stress of the intermetallic compound TiAl

1989 ◽  
Vol 23 (4) ◽  
pp. 467-469 ◽  
Author(s):  
V.K. Vasudevan ◽  
S.A. Court ◽  
P. Kurath ◽  
H.L. Fraser
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Yield Stress ◽  
Compound Tial

scholarly journals Diffusion Bonding of Intermetallic Compound TiAl.

1991 ◽  
Vol 31 (10) ◽  
pp. 1260-1266 ◽  
Author(s):  
Yoshikuni Nakao ◽  
Kenji Shinozaki ◽  
Masahiko Hamada
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Bonding ◽  
Compound Tial
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