Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films
2008 ◽
Vol 2008
(0)
◽
pp. _OS0620-1_-_OS0620-2_
◽
1988 ◽
Vol 49
(C5)
◽
pp. C5-451-C5-456
◽
2001 ◽
Vol 318
(1-2)
◽
pp. 285-292
◽
2007 ◽
Vol 558-559
◽
pp. 873-878
◽
2007 ◽
Vol 26-28
◽
pp. 1003-1006
◽
2013 ◽
Vol 690-693
◽
pp. 139-146
◽