Performance optimisation of microchannel pin-fins using 2D CFD

Author(s):  
Justina Jaseliūnaitė ◽  
Marijus Šeporaitis
Keyword(s):  
Author(s):  
Tyler G. Vincent ◽  
Joseph A. Schetz ◽  
K. Todd Lowe
Keyword(s):  

2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  

2011 ◽  
Vol 42 (1) ◽  
pp. 65-81 ◽  
Author(s):  
Gongnan Xie ◽  
Bengt Sunden ◽  
Lieke Wang ◽  
Esa Utriainien
Keyword(s):  
Pin Fins ◽  

Author(s):  
Yusuke Motoda ◽  
Kenichiro Takeishi ◽  
Yutaka Oda ◽  
Yoshiaki Miyake
Keyword(s):  

Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


2017 ◽  
Vol 140 (3) ◽  
Author(s):  
Fayao Xu ◽  
Huiying Wu ◽  
Zhenyu Liu

In this paper, the flow patterns during water flow boiling instability in pin-fin microchannels were experimentally studied. Three types of pin-fin arrays (in-line/circular pin-fins, staggered/circular pin-fins, and staggered/square pin-fins) were used in the study. The flow instability started to occur as the outlet water reached the saturation temperature. Before the unstable boiling, a wider range of stable boiling existed in the pin-fin microchannels compared to that in the plain microchannels. Two flow instability modes for the temperature and pressure oscillations, which were long-period/large-amplitude mode and short-period/small-amplitude mode, were identified. The temperature variation during the oscillation period of the long-period/large-amplitude mode can be divided into two stages: increasing stage and decreasing stage. In the increasing stage, bubbly flow, vapor-slug flow, stratified flow, and wispy flow occurred sequentially with time for the in-line pin-fin microchannels; liquid single-phase flow, aforementioned four kinds of two-phase flow patterns, and vapor single-phase flow occurred sequentially with time for the staggered pin-fin microchannel. The flow pattern transitions in the decreasing stage were the inverse of those in the increasing stage for both in-line and staggered pin-fin microchannels. For the short-period/small-amplitude oscillation mode, only the wispy flow occurred. With the increase of heat flux, the wispy flow and the vapor single-phase flow occupied more and more time ratio during an oscillation period in the in-line and staggered pin-fin microchannels.


Sign in / Sign up

Export Citation Format

Share Document