scholarly journals Systematic Micro Heat Sink Optimization based on Hydrofoil Shape Pin Fins

Author(s):  
Fuad Ismayilov ◽  
Ali Akturk ◽  
Yoav Peles
2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  

Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


Author(s):  
Ali Kosar ◽  
Chih-Jung Kuo ◽  
Yoav Peles

An experimental study on thermal-hydraulic performance of de-ionized water over a bank of shrouded NACA 66-021 hydrofoil micro pin fins with wetted perimeter of 1030-μm and chord thickness of 100 μm has been performed. Average heat transfer coefficients have been obtained over effective heat fluxes ranging from 4.0 to 308 W/cm2 and mass velocities from 134 to 6600 kg/m2s. The experimental data is reduced to the Nusselt numbers, Reynolds numbers, total thermal resistances, and friction factors in order to determine the thermal-hydraulic performance of the heat sink. It has been found that prodigious hydrodynamic improvement can be obtained with the hydrofoil-based micro pin fin heat sink compared to the circular pin fin device. Fluid flow over pin fin heat sinks comprised from hydrofoils yielded radically lower thermal resistances than circular pin fins for a similar pressure drop.


2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Kyoung Joon Kim

In this paper we introduce a hybrid fin heat sink (HFH) proposed for the thermal control of light emitting diode (LED) lighting modules. The HFH consists of the array of hybrid fins which are hollow pin fins having internal channels and integrated with plate fins. The thermal performance of the HFH under either natural or forced convection condition is both experimentally and numerically investigated, and then its performance is compared with that of a pin fin heat sink (PFH). The observed maximum discrepancies of the numerical prediction to the measurement for the HFH are 7% and 6% for natural and forced convection conditions. The reasonable discrepancies demonstrate the tight correlation between the numerical prediction and the measurement. The thermal performance of the HFH is found to be 12–14% better than the PFH for the natural convection condition. The better performance might be explained by the enlarged external surface and the internal flow via the channel of the HF. The reference HFH is about 14% lighter than the reference PFH. The better thermal performance and the lighter weight of the HFH show the feasibility as the promising heat sink especially for the thermal control of LED street and flood lighting modules.


Sign in / Sign up

Export Citation Format

Share Document