High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications

2007 ◽  
Vol 253 (7) ◽  
pp. 3595-3599 ◽  
Author(s):  
R. Singh ◽  
I. Radu ◽  
M. Reiche ◽  
C. Himcinschi ◽  
B. Kuck ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Silicon Layer ◽  
High Density ◽  
Strained Silicon ◽  
Layer Transfer ◽  
Thermal Oxide ◽  
Density Plasma

Low-Temperature Direct CVD Oxides to Thermal Oxide Wafer Bonding in Silicon Layer Transfer

2005 ◽  
Vol 8 (1) ◽  
pp. G1 ◽  
Author(s):  
C. S. Tan ◽  
K. N. Chen ◽  
A. Fan ◽  
R. Reif
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Silicon Layer ◽  
Layer Transfer ◽  
Thermal Oxide

Uniaxially strained silicon by wafer bonding and layer transfer

2007 ◽  
Vol 51 (2) ◽  
pp. 226-230 ◽  
Author(s):  
C. Himcinschi ◽  
I. Radu ◽  
F. Muster ◽  
R. Singh ◽  
M. Reiche ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Strained Silicon ◽  
Layer Transfer

Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding

2010 ◽  
Vol 39 (10) ◽  
pp. 2233-2236 ◽  
Author(s):  
Ki Yeol Byun ◽  
Isabelle Ferain ◽  
Scott Song ◽  
Susan Holl ◽  
Cindy Colinge
Keyword(s):  
Wafer Bonding ◽  
Crystalline Silicon ◽  
Flexible Substrate ◽  
Silicon Layer ◽  
Single Crystalline Silicon ◽  
Layer Transfer ◽  
Single Crystalline

Silicon layer transfer using wafer bonding and debonding

2001 ◽  
Vol 30 (7) ◽  
pp. 841-844 ◽  
Author(s):  
Cynthia Colinge ◽  
Brian Roberds ◽  
Brian Doyle
Keyword(s):  
Wafer Bonding ◽  
Silicon Layer ◽  
Layer Transfer

Relaxed graded SiGe donor substrates incorporating hydrogen-gettering and buried etch stop layers for strained silicon layer transfer applications

2007 ◽  
Vol 101 (1) ◽  
pp. 013522 ◽  
Author(s):  
David M. Isaacson ◽  
Arthur J. Pitera ◽  
Eugene A. Fitzgerald
Keyword(s):  
Silicon Layer ◽  
Strained Silicon ◽  
Layer Transfer ◽  
Etch Stop

Compressive uniaxially strained silicon on insulator by prestrained wafer bonding and layer transfer

2007 ◽  
Vol 90 (23) ◽  
pp. 231909 ◽  
Author(s):  
C. Himcinschi ◽  
M. Reiche ◽  
R. Scholz ◽  
S. H. Christiansen ◽  
U. Gösele
Keyword(s):  
Wafer Bonding ◽  
Silicon On Insulator ◽  
Strained Silicon ◽  
Layer Transfer

3-D Integration Latest Developments at LETI

2006 ◽  
Vol 970 ◽  
Author(s):  
Barbara Charlet
Keyword(s):  
Wafer Bonding ◽  
Crucial Role ◽  
3D Structure ◽  
High Density ◽  
Layer Transfer ◽  
Wafer Level ◽  
Hetero Structure ◽  
Front End ◽  
Integration Approach ◽  
Advanced Packaging

ABSTRACTWe review the latest 3-D integration developments performed in LETI, giving some devices integration examples and discussing the achieved performances. Direct bonding and layer transfer (smart cut™) is now largely used to process innovative substrates like: SOI, SSOI, GeOI, … and others. This type of new substrate can play a crucial role in 3D structure integration and can answer the requirements for new challenging performances.3-D integration approach has been used and will be presented in the following topics: advanced packaging by neo-wafers, chip to wafers integration, hetero-structures integration and wafer to wafer concept (front and back-end application). The examples of neo-wafer rebuilding for advanced packaging, the hetero- structure achieved by chip-to-wafer or wafer-to-wafer bonding and front-end and back-end architecture are discussed regarding the 3-D integration challenging requirements. The challenging cases of wafer-level integrated demonstrators for high density 3D inter-chips connections and wireless interconnections are presented. For some examples we give also the first electrical performances achieved with representative demonstrators.

Comparison of SiGe Virtual Substrates for the Fabrication of Strained Silicon-on-Insulator (sSOI) Using Wafer Bonding and Layer Transfer

2019 ◽  
Vol 3 (7) ◽  
pp. 317-324 ◽  
Author(s):  
Manfred Reiche ◽  
Ionut Radu ◽  
Cameliu Himcinschi ◽  
Rajendra Singh ◽  
Silke Christiansen ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Silicon On Insulator ◽  
Strained Silicon ◽  
Layer Transfer
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