Effect of pyrolysis atmospheres on the morphology of polymer-derived silicon oxynitrocarbide ceramic films coated aluminum nitride surface and the thermal conductivity of silicone rubber composites

2014 ◽  
Vol 292 ◽  
pp. 319-327 ◽  
Author(s):  
Hsien T. Chiu ◽  
Tanapon Sukachonmakul ◽  
Chen H. Wang ◽  
Karnthidaporn Wattanakul ◽  
Ming T. Kuo ◽  
...  
RSC Advances ◽  
2019 ◽  
Vol 9 (49) ◽  
pp. 28851-28856 ◽  
Author(s):  
Zhenzhen Ou ◽  
Feng Gao ◽  
Huaijun Zhao ◽  
Shumeng Dang ◽  
Lingjian Zhu

The present work aims at studying the thermal and dielectric properties of addition-cure liquid silicone rubber (ALSR) matrix composites using boron nitride (BN) and aluminum nitride (AlN) as a hybrid thermal conductive filler.


Materials ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2489
Author(s):  
Jianjun Zheng ◽  
Shaojian He ◽  
Jiaqi Wang ◽  
Wenxuan Fang ◽  
Yang Xue ◽  
...  

In this study, silicone rubber (SR) composites were prepared with various amounts of aluminum nitride (AlN) and alumina tri-hydrate (ATH), and vinyl tri-methoxysilane (VTMS) was also introduced to prepare SR/ATH/AlN–VTMS composites for comparison. Compared to the SR/ATH composites, the SR/ATH/AlN composites with higher AlN loading exhibited higher breakdown strength and thermal conductivity, which were further improved by the addition of VTMS. Such results were related to the enhanced rubber–filler interfacial interactions from VTMS coupling, as demonstrated by scanning electron microscopy (SEM) analysis and the curing behaviors of the SR composites. Moreover, by replacing ATH with VTMS-coupled AlN, the SR/ATH/AlN–VTMS composites also exhibited lower dielectric loss along with an increased dielectric constant, suggesting the promising application of VTMS-coupled AlN as a filler for the preparation of the SR composites as high-voltage insulators.


2017 ◽  
Vol 9 (4) ◽  
pp. 168781401769762 ◽  
Author(s):  
Limei Tian ◽  
Yangjun Wang ◽  
E Jin ◽  
Yinwu Li ◽  
Runmao Wang ◽  
...  

2014 ◽  
Vol 117 (4) ◽  
pp. 1985-1992 ◽  
Author(s):  
J. P. Cheng ◽  
T. Liu ◽  
J. Zhang ◽  
B. B. Wang ◽  
J. Ying ◽  
...  

2014 ◽  
Vol 22 (5) ◽  
pp. 453-458
Author(s):  
Dongsheng Xie ◽  
Xianfeng Meng ◽  
Jie Ma ◽  
Lin Zhu ◽  
Xiangqian Shen

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