An investigation of surface contamination introduced during He+ implantation and subsequent effects on the thermal oxidation of Cu

2021 ◽  
pp. 152163
Author(s):  
Subing Yang ◽  
Yuki Nakagawa ◽  
Tamaki Shibayama
Keyword(s):  
Thermal Oxidation ◽  
Surface Contamination

scholarly journals Nanoscale Measurement of Surface Roughness and the existing Surface Forces of Aluminum by AFM

2011 ◽  
Vol 2 ◽  
pp. 76-79
Author(s):  
Purna B Pun ◽  
Shobha K Lamichhane
Keyword(s):  
Surface Roughness ◽  
Atomic Force Microscope ◽  
Thermal Oxidation ◽  
Surface Force ◽  
Surface Forces ◽  
Crystal Defects ◽  
Surface Contamination ◽  
Thermal Agitation ◽  
Atomic Force ◽  
Aluminum Sample

The surface contamination affects Atomic Force Microscope (AFM) performance. Thermal agitation during mapping doping, thermal oxidation, annealing impurities and crystal defects promotes the roughness; various kinds of forces on the surface can be detected by the interaction between tip of cantilever and sample. This interaction not only help us to understand the characteristics and morphology of the sample but also useful to measure the surface force of the aluminum sample too.Key words: Atomic Force Microscope (AFM) performance; Thermal oxidation; Annealing impurities; Crystal defectsThe Himalayan Physics Vol.2, No.2, May, 2011Page: 76-79Uploaded Date: 1 August, 2011

383. Field Evaluation of a Libs Sampler for Determining Surface Contamination Due to Beryllium

2002 ◽  
Author(s):  
M. Hoover ◽  
M. McCawley ◽  
D. Yereb ◽  
S. Tinkle ◽  
S. Beaton ◽  
...  
Keyword(s):  
Field Evaluation ◽  
Surface Contamination

Effects of Thermal Oxidation and Subsequent Pickling on Pitting Geometry of Austentitic Stainless Steels in Chloride Solutions

2011 ◽  
Vol 53 (10) ◽  
pp. 634-638 ◽  
Author(s):  
Vesna Alar ◽  
Ivan Esih ◽  
Ivan Budic ◽  
Slavonski Brod
Keyword(s):  
Thermal Oxidation ◽  
Stainless Steels ◽  
Chloride Solutions

Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication

2005 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Failure Analysis ◽  
Galvanic Corrosion ◽  
Surface Contamination ◽  
Wafer Fabrication ◽  
Tof Sims ◽  
Corrosion Passivation

Abstract A failure analysis flow is developed for surface contamination, corrosion and underetch on microchip Al bondpads and it is applied in wafer fabrication. SEM, EDX, Auger, FTIR, XPS and TOF-SIMS are used to identify the root causes. The results from carbon related contamination, galvanic corrosion, fluorine-induced corrosion, passivation underetch and Auger bondpad monitoring will be presented. The failure analysis flow will definitely help us to select suitable methods and tools for failure analysis of Al bondpad-related issues, identify rapidly possible root causes of the failures and find the eliminating solutions at both wafer fabrication and assembly houses.

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