scholarly journals Diffusional kurtosis imaging reveals taVNS facilitates microstructural changes in the developing neonatal brain

2021 ◽  
Vol 14 (6) ◽  
pp. 1665-1666
Author(s):  
Hunter Moss ◽  
Jens Jensen ◽  
Bashar Badran ◽  
Mark George ◽  
Dorothea Jenkins
Keyword(s):  
Neonatal Brain ◽  
Microstructural Changes ◽  
Diffusional Kurtosis Imaging

scholarly journals Cervical spondylosis: Evaluation of microstructural changes in spinal cord white matter and gray matter by diffusional kurtosis imaging

2014 ◽  
Vol 32 (5) ◽  
pp. 428-432 ◽  
Author(s):  
Masaaki Hori ◽  
Satoshi Tsutsumi ◽  
Yukimasa Yasumoto ◽  
Masanori Ito ◽  
Michimasa Suzuki ◽  
...  
Keyword(s):  
Spinal Cord ◽  
White Matter ◽  
Gray Matter ◽  
Cervical Spondylosis ◽  
Microstructural Changes ◽  
Diffusional Kurtosis Imaging

Phenomena Associated with Oxygen in Titanium

1967 ◽  
Vol 25 ◽  
pp. 310-311
Author(s):  
E. U. Lee ◽  
P. A. Garner ◽  
J. S. Owens
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Electron Microscope ◽  
Microstructural Changes ◽  
Electrolytic Polishing ◽  
Interstitial Impurities ◽  
Thin Foils ◽  
Transmission Electron ◽  
Iodide Titanium ◽  
Alpha Titanium

Evidence for ordering (1-6) of interstitial impurities (O and C) has been obtained in b.c.c. metals, such as niobium and tantalum. In this paper we report the atomic and microstructural changes in an oxygenated c.p.h. metal (alpha titanium) as observed by transmission electron microscopy and diffraction.Oxygen was introduced into zone-refined iodide titanium sheets of 0.005 in. thickness in an atmosphere of oxygen and argon at 650°C, homogenized at 800°C and furnace-cooled in argon. Subsequently, thin foils were prepared by electrolytic polishing and examined in a JEM-7 electron microscope, operated at 100 KV.

Tensile Creep of Y-Si3N4: II. Cavitation

1991 ◽  
Vol 49 ◽  
pp. 972-973 ◽  
Author(s):  
B. J. Hockey ◽  
S. M. Wiederhorn
Keyword(s):  
Silicon Nitride ◽  
Creep Rupture ◽  
Tensile Creep ◽  
Sintering Aids ◽  
Microstructural Changes

ATEM has been used to characterize three different silicon nitride materials after tensile creep in air at 1200 to 1400° C. In Part I, the microstructures and microstructural changes that occur during testing were described, and consistent with that description the designations and sintering aids for these materials were: W/YAS, a SiC whisker reinforced Si3N4 processed with yttria (6w/o) and alumina (1.5w/o); YAS, Si3N4 processed with yttria (6 w/o) and alumina (1.5w/o); and YS, Si3N4 processed with yttria (4.0 w/o). This paper, Part II, addresses the interfacial cavitation processes that occur in these materials and which are ultimately responsible for creep rupture.

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