Enhancing cover glass fracture resistance for hand-held devices with PEALD-based Al2O3 coating

2019 ◽  
Vol 45 (15) ◽  
pp. 19496-19503
Author(s):  
Jiachen Gao ◽  
Hoyeon Kim ◽  
Jaeyeol Kim ◽  
Jae B. Kwak
Keyword(s):  
Fracture Resistance ◽  
Al2o3 Coating ◽  
Cover Glass ◽  
Glass Fracture

Flat embeddment of monolayer cells, tissue sections, and other cellular materials attached onto glass substrate

1990 ◽  
Vol 48 (3) ◽  
pp. 766-767
Author(s):  
Jeffrey P. Chang ◽  
Jaang J. Wang
Keyword(s):  
Present Report ◽  
Cellular Materials ◽  
Cover Glass ◽  
Tissue Sections ◽  
Embedding Technique ◽  
Exfoliated Cells ◽  
Black Paper ◽  
Cell Concentrations ◽  
Flat Embedding

Flat embeddment of certain specimens for electron microscopy is necessary for three classes of biological materials: namely monolayer cells, tissue sections of paraffin or plastics, as well as cell concentrations, exfoliated cells, and cell smears. The present report concerns a flat-embedding technique which can be applied to all these three classes of materials and which is a modified and improved version of Chang's original methodology.Preparation of coverglasses and microslides. Chemically cleaned coverglasses, 11 × 22 mm or other sizes, are laid in rows on black paper. Ink-mark one coner for identifying the spray-side of the glass for growing cells. Lightly spray with Teflon monomer (Heddy/Contact Inductries, Paterson, NO 07524, U.S.A.) from a pressurized can. Bake the sprayed glasses at 500°F for 45 min on Cover-Glass Ceramic Racks (A. Thomas Co. Philadelphia), for Teflon to polymerize.Monolayer Cells. After sterilization, the Teflon-treated coverglasses, with cells attached, are treated or fixed in situ in Columbia staining dishes (A. Thomas Co., Philadelphia) for subsequent processing.

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

Influence of the Zinc Sublayer Method Production and Heat Treatment on the Microhardness of the Composite Ni-Al2O3 Coating Deposited on the 5754 Aluminium Alloy

2014 ◽  
Vol 59 (1) ◽  
pp. 355-358
Author(s):  
M. Karaś ◽  
M. Nowak ◽  
M. Opyrchał ◽  
M. Bigaj ◽  
A. Najder
Keyword(s):  
Heat Treatment ◽  
Aluminium Alloy ◽  
Thermal Shock ◽  
Nickel Coating ◽  
Nickel Sulphate ◽  
Al2o3 Coating ◽  
Nickel Coatings ◽  
Watts Bath ◽  
Before And After ◽  
Zinc Interlayer

Abstract In this study, the effect of zinc interlayer on the adhesion of nickel coatings reinforced with micrometric Al2O3 particles was examined. Nickel coating was applied by electroplating on EN AW - 5754 aluminium alloy using Watts bath at a concentration of 150 g/l of nickel sulphate with the addition of 50 g/l of Al2O3. The influence of zinc intermediate coating deposited in single, double and triple layers on the adhesion of nickel coating to aluminium substrate was also studied. The adhesion was measured by the thermal shock technique in accordance with PN-EN ISO 2819. The microhardness of nickel coating before and after heat treatment was additionally tested. It was observed that the number of zinc interlayers applied does not significantly affect the adhesion of nickel which is determined by thermal shock. No defect that occurs after the test, such as delamination, blistering or peeling of the coating was registered. Microhardness of the nickel coatings depends on the heat treatment and the amount of zinc in the interlayer. For both single and double zinc interlayer, the microhardness of the nickel coating containing Al2O3 particles increased after heat treatment, but decreased when a triple zinc interlayer was applied.

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