Enhanced mechanical properties and thermal cycling stability of Al2O3-4J42 joints brazed using Ag–Cu–Ti/Cu/Ag–Cu composite filler

2021 ◽  
Author(s):  
Qianying Zhu ◽  
Shenhou Li ◽  
Kangjia Hu ◽  
Xuewei Liang ◽  
Yangyang Cai ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Cycling ◽  
Cycling Stability ◽  
Composite Filler

Excellent thermal-cycling stability caused by aging in Fe-doped (Ba0.85Ca0.15)(Ti0.9Zr0.1)O3 lead-free piezoceramic

2021 ◽  
Vol 202 ◽  
pp. 113990
Author(s):  
Yanshuang Hao ◽  
Liqiang He ◽  
Shuai Ren ◽  
Yuanchao Ji ◽  
Xiaobing Ren
Keyword(s):  
Thermal Cycling ◽  
Cycling Stability ◽  
Lead Free

Effect of thermal cycling on the mechanical properties of carbon nanotubes reinforced copper matrix nanolaminated composites

2019 ◽  
Vol 739 ◽  
pp. 132-139 ◽  
Author(s):  
Jiapeng Liu ◽  
Ding-Bang Xiong ◽  
Yishi Su ◽  
Qiang Guo ◽  
Zhiqiang Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Carbon Nanotubes ◽  
Thermal Cycling ◽  
Copper Matrix

The thermal cycling method induces structural defects to enhance the mechanical properties of FeGa alloys

2021 ◽  
pp. 142579
Author(s):  
Guolin Xiao ◽  
Wei Zhang ◽  
Zhichao Ma ◽  
Hairui Du ◽  
Weizhi Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Cycling ◽  
Structural Defects

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

1998 ◽  
Vol 120 (4) ◽  
pp. 322-327 ◽  
Author(s):  
H. Doi ◽  
K. Kawano ◽  
A. Yasukawa ◽  
T. Sato
Keyword(s):  
Mechanical Properties ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Failure Mode ◽  
Flip Chip ◽  
Solder Joints ◽  
Alumina Substrate ◽  
Heat Spreader ◽  
Flip Chips ◽  
Heat Spreaders

The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.

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