Efficient and slurryless ultrasonic vibration assisted electrochemical mechanical polishing for 4H–SiC wafers

Author(s):  
Xiaozhe Yang ◽  
Xu Yang ◽  
Haiyang Gu ◽  
Kentaro Kawai ◽  
Kenta Arima ◽  
...  
2011 ◽  
Vol 314-316 ◽  
pp. 1846-1850 ◽  
Author(s):  
Shuai Guo ◽  
Z.N Guo ◽  
Hong Ping Luo ◽  
Wen Cai Gu

The mechanism of the elctrochemical mechanical polishing (ECMP) technology for micro tool electrode was investigated. In this paper, suitable major process parameters on the surface quality were evaluated, the major parameters contains electrical parameters, machining gap, the working fluid and other factors. In quantitative analyses, the process of the ECMP technology were conducted. The roughness of the workpiece was reduced from a relatively high value to a mirror effect.


2016 ◽  
Vol 24 (2) ◽  
pp. 343-349 ◽  
Author(s):  
张克华 ZHANG Ke-hua ◽  
石 栋 SHI Dong ◽  
刘润之 LIU Run-zhi ◽  
肖志兰 XIAO Zhi-lan ◽  
程光明 CHENG Guang-ming

2018 ◽  
Vol 271 ◽  
pp. 666-676 ◽  
Author(s):  
Xu Yang ◽  
Rongyan Sun ◽  
Yuji Ohkubo ◽  
Kentaro Kawai ◽  
Kenta Arima ◽  
...  

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