Biocatalytic process intensification via efficient biocatalyst immobilization, miniaturization, and process integration

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

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Artificial intelligence and the management transformation

National Interests Priorities and Security ◽

10.24891/ni.16.4.600 ◽

2020 ◽

Vol 16 (4) ◽

pp. 600-612

Author(s):

L.F. Nikulin ◽

V.V. Velikorossov ◽

S.A. Filin ◽

A.B. Lanchakov

Keyword(s):

Artificial Intelligence ◽

Social Life ◽

Soft Power ◽

Process Integration ◽

Management Practice ◽

Scientific School ◽

Strategic Culture ◽

Analysis And Synthesis ◽

And Training

Subject. The article discusses how management transforms as artificial intelligence gets more important in governance, production and social life. Objectives. We identify and substantiate trends in management transformation as artificial intelligence evolves and gets more important in governance, production and social life. The article also provides our suggestions for management and training of managers dealing with artificial intelligence. Methods. The study employs methods of logic research, analysis and synthesis through the systems and creative approach, methodology of technological waves. Results. We analyzed the scope of management as is and found that threats and global challenges escalate due to the advent of artificial intelligence. We provide the rationale for recognizing the strategic culture as the self-organizing system of business process integration. We suggest and substantiate the concept of soft power with reference to strategic culture, which should be raised, inter alia, through the scientific school of conflict studies. We give our recommendations on how management and training of managers should be improved in dealing with artificial intelligence as it evolves. The novelty hereof is that we trace trends in management transformation as the role of artificial intelligence evolves and growth in governance, production and social life. Conclusions and Relevance. Generic solutions are not very effective for the Russian management practice during the transition to the sixth and seventh waves of innovation. Any programming product represents artificial intelligence, which simulates a personality very well, though unable to substitute a manager in motivating, governing and interacting with people.

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