interlayer dielectrics
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2021 ◽  
Author(s):  
Yudi Feng ◽  
Ke Jin ◽  
Jia Guo ◽  
Changchun Wang

The development of modern microelectronic industry calls for low permittivity interlayer dielectric materials with excellent thermal stabilities, robust mechanical strength and matching processability. Traditionally, it is difficult to fabricate materials...


2020 ◽  
Vol 90 ◽  
pp. 106704
Author(s):  
A.I. Barzic ◽  
C. Hulubei ◽  
M. Asandulesa ◽  
G. Lisa ◽  
D. Popovici ◽  
...  

2019 ◽  
Vol 35 (4) ◽  
pp. 747-756 ◽  
Author(s):  
Brad C. Bittel ◽  
Thomas Pomorski ◽  
Patrick M. Lenahan ◽  
Sean King

Author(s):  
Soojung Kang ◽  
Yejin Kim ◽  
Ayoung Moon ◽  
Sangwon Lee ◽  
Sarah Eunkyung Kim ◽  
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2017 ◽  
Vol 3 (12) ◽  
pp. 1700116 ◽  
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Bradley J. Nordell ◽  
Thuong D. Nguyen ◽  
Anthony N. Caruso ◽  
Sudhaunshu S. Purohit ◽  
Nathan A. Oyler ◽  
...  

Author(s):  
Christoph Steinbrüchel ◽  
Barry L. Chin

Author(s):  
Honggun Kim ◽  
Seungheon Lee ◽  
Jun-Won Lee ◽  
ByeongJu Bae ◽  
YongSoon Choi ◽  
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