Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

2013 ◽  
Vol 51 ◽  
pp. 140-147 ◽  
Author(s):  
Seran Choi ◽  
Jooheon Kim
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Aluminum Oxide ◽  
Particle System ◽  
Epoxy Composites ◽  
Binary Particle System

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Enhanced thermal conductivity of epoxy composites by constructing aluminum nitride honeycomb reinforcements

2020 ◽  
Vol 199 ◽  
pp. 108304 ◽  
Author(s):  
Zhilei Wei ◽  
Wenqi Xie ◽  
Bangzhi Ge ◽  
Zhejian Zhang ◽  
Wanli Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Epoxy Composites ◽  
Enhanced Thermal Conductivity

Thermal and mechanical properties of epoxy composite filled with binary particle system of polygonal aluminum oxide and boron nitride platelets

2016 ◽  
Vol 51 (16) ◽  
pp. 7415-7426 ◽  
Author(s):  
Anithambigai Permal ◽  
Mutharasu Devarajan ◽  
Huong Ling Hung ◽  
Thomas Zahner ◽  
David Lacey ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Boron Nitride ◽  
Aluminum Oxide ◽  
Epoxy Composite ◽  
Particle System ◽  
Thermal And Mechanical Properties ◽  
Binary Particle System

High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

2012 ◽  
Vol 537 ◽  
pp. 70-75 ◽  
Author(s):  
Jung-Pyo Hong ◽  
Sung-Woon Yoon ◽  
Taeseon Hwang ◽  
Joon-Suk Oh ◽  
Seung-Chul Hong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Bimodal Distribution ◽  
High Thermal Conductivity ◽  
Epoxy Composites

Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Polimery ◽  
2017 ◽  
Vol 62 (7/8) ◽  
pp. 560-566 ◽  
Author(s):  
John M. Hutchinson ◽  
Frida Roman ◽  
Pilar Cortes ◽  
Yolanda Calventus
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Epoxy Composites

Nano–micro structure of functionalized boron nitride and aluminum oxide for epoxy composites with enhanced thermal conductivity and breakdown strength

RSC Advances ◽  
2014 ◽  
Vol 4 (40) ◽  
pp. 21010-21017 ◽  
Author(s):  
Lijun Fang ◽  
Chao Wu ◽  
Rong Qian ◽  
Liyuan Xie ◽  
Ke Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Oxide ◽  
Breakdown Strength ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Micro Structure ◽  
Ceramic Fillers ◽  
Enhanced Thermal Conductivity

Nano-micro structure of modified 2-D and 0-D ceramic fillers is designed for epoxy with high thermal conductivity and breakdown strength.

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