Dense graphene foam and hexagonal boron nitride filled PDMS composites with high thermal conductivity and breakdown strength

2017 ◽  
Vol 152 ◽  
pp. 243-253 ◽  
Author(s):  
Haoming Fang ◽  
Xiao Zhang ◽  
Yunhong Zhao ◽  
Shu-Lin Bai
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Breakdown Strength ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Graphene Foam

scholarly journals Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

2020 ◽  
Vol 4 (3) ◽  
pp. 116
Author(s):  
Maryam Khalaj ◽  
Sanaz Zarabi Golkhatmi ◽  
Sayed Ali Ahmad Alem ◽  
Kahila Baghchesaraee ◽  
Mahdi Hasanzadeh Azar ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Recent Progress ◽  
Phonon Scattering ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Promising Candidate ◽  
Reinforced Composite ◽  
Low Thermal Expansion ◽  
Wide Range

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

Recyclable thermoplastic hexagonal boron nitride composites with high thermal conductivity

2019 ◽  
Vol 163 ◽  
pp. 723-729 ◽  
Author(s):  
Haeun Shin ◽  
Seokhoon Ahn ◽  
Doohun Kim ◽  
Jong Kuk Lim ◽  
Chae Bin Kim ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity

Anisotropy-Driven High Thermal Conductivity in Stretchable Poly(vinyl alcohol)/Hexagonal Boron Nitride Nanohybrid Films

2018 ◽  
Vol 10 (40) ◽  
pp. 34625-34633 ◽  
Author(s):  
O. Hwan Kwon ◽  
Taeyong Ha ◽  
Dong-Gyun Kim ◽  
Byoung Gak Kim ◽  
Yong Seok Kim ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Vinyl Alcohol ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Poly Vinyl Alcohol

Fabrication of Highly Oriented Hexagonal Boron Nitride Nanosheet/Elastomer Nanocomposites with High Thermal Conductivity

Small ◽  
2014 ◽  
Vol 11 (14) ◽  
pp. 1655-1659 ◽  
Author(s):  
Zhiqiao Kuang ◽  
Yulong Chen ◽  
Yonglai Lu ◽  
Li Liu ◽  
Shui Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity ◽  
Boron Nitride Nanosheet

High thermal conductivity of suspended few-layer hexagonal boron nitride sheets

Nano Research ◽  
2014 ◽  
Vol 7 (8) ◽  
pp. 1232-1240 ◽  
Author(s):  
Haiqing Zhou ◽  
Jixin Zhu ◽  
Zheng Liu ◽  
Zheng Yan ◽  
Xiujun Fan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
High Thermal Conductivity

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
High Thermal Conductivity ◽  
Thermally Conductive ◽  
Promising Solution ◽  
Mechanical Pressing ◽  
Insulating Properties

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

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