Reflection analysis for Stoneley waves encountering interfacial delamination

2020 ◽  
Vol 253 ◽  
pp. 112771
Author(s):  
Ming-hang Li ◽  
Bing Li ◽  
Zhi-yuan Zhang ◽  
Guang-yuan Gao
Keyword(s):  
Stoneley Waves ◽  
Interfacial Delamination

scholarly journals Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects

2021 ◽  
Vol 43 ◽  
pp. 101199
Author(s):  
Jacob Brenneman ◽  
Derya Z. Tansel ◽  
Gary K. Fedder ◽  
Rahul Panat
Keyword(s):  
Interfacial Delamination ◽  
Electrical Interconnects ◽  
3D Printed

scholarly journals Cohesive Zone Modeling for Predicting Interfacial Delamination in over mold Components

2021 ◽  
Vol 1128 (1) ◽  
pp. 012018
Author(s):  
M Sai Krishnan ◽  
S Jeyanthi ◽  
Pradeep Kumar Mani ◽  
K T Hareesh ◽  
M. C Lenin Babu
Keyword(s):  
Cohesive Zone ◽  
Cohesive Zone Modeling ◽  
Interfacial Delamination ◽  
Zone Modeling

Interfacial Delamination in Plastic Encapsulated Integrated Circuits (Pics)

1996 ◽  
Vol 445 ◽  
Author(s):  
Nickolaos Strifas ◽  
Aris Christou
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Stress Corrosion ◽  
Integrated Circuit ◽  
Point Of View ◽  
Acoustic Microscopy ◽  
Electrical Performance ◽  
Premature Failure ◽  
Interfacial Delamination ◽  
Die Surface

AbstractThe reliability of plastic packaged integrated circuits was assessed from the point of view of interfacial mechanical integrity. It is shown that the effect of structural weaknesses caused by poor bonding, voids, microcracks or delamination may not be evident in the electrical performance characteristics, but may cause premature failure. Acoustic microscopy (C-SAM) was selected for nondestructive failure analysis of the plastic integrated circuit (IC) packages. Integrated circuits in plastic dual in line packages were initially subjected to temperature (25 °C to 85 °C) and humidity cycling (50 to 85 %) where each cycle was of one hour duration and for over 100 cycles and then analyzed. Delamination at the interfaces between the different materials within the package, which is a major cause of moisture ingress and subsequent premature package failure, was measured. The principal areas of delamination were found along the leads extending from the chip to the edge of the molded body and along the die surface itself. Images of the 3-D internal structure were produced that were used to determine the mechanism for a package failure. The evidence of corrosion and stress corrosion cracks in the regions of delamination was identified.

Lessons Learnt from Spatially Resolved Electro- and Photoluminescence Imaging: Interfacial Delamination in CH3 NH3 PbI3 Planar Perovskite Solar Cells upon Illumination

2016 ◽  
Vol 7 (9) ◽  
pp. 1602111 ◽  
Author(s):  
Arman Mahboubi Soufiani ◽  
Ziv Hameiri ◽  
Steffen Meyer ◽  
Sean Lim ◽  
Murad Jehangir Yusuf Tayebjee ◽  
...  
Keyword(s):  
Solar Cells ◽  
Perovskite Solar Cells ◽  
Interfacial Delamination ◽  
Spatially Resolved ◽  
Lessons Learnt

Stoneley waves at grain boundaries in copper

1984 ◽  
Vol 32 (3) ◽  
pp. 349-356 ◽  
Author(s):  
A.R. Thölén
Keyword(s):  
Grain Boundaries ◽  
Stoneley Waves

Quantitative Formation Permeability Evaluation from Stoneley Waves

1998 ◽  
Author(s):  
A. Brie ◽  
T. Endo ◽  
D.L. Johnson ◽  
F. Pampuri
Keyword(s):  
Stoneley Waves ◽  
Quantitative Formation ◽  
Permeability Evaluation

A three-dimensional self-adaptive cohesive zone model for interfacial delamination

2011 ◽  
Vol 200 (49-52) ◽  
pp. 3540-3553 ◽  
Author(s):  
M. Samimi ◽  
J.A.W. van Dommelen ◽  
M.G.D. Geers
Keyword(s):  
Cohesive Zone ◽  
Cohesive Zone Model ◽  
Three Dimensional ◽  
Zone Model ◽  
Interfacial Delamination ◽  
Self Adaptive

A Method to Evaluate the Elastic Properties of Ceramics-Enhanced Composites Undertaking Interfacial Delamination

2007 ◽  
Vol 336-338 ◽  
pp. 2513-2516
Author(s):  
Hua Jian Chang ◽  
Shu Wen Zhan
Keyword(s):  
Composite Materials ◽  
Present Method ◽  
Present Model ◽  
Constitutive Law ◽  
Layer Model ◽  
Interfacial Delamination ◽  
Equivalent Inclusion Method ◽  
Equivalent Inclusion ◽  
Micromechanical Approach ◽  
Properties Of Composites

A micromechanical approach is developed to investigate the behavior of composite materials, which undergo interfacial delamination. The main objective of this approach is to build a bridge between the intricate theories and the engineering applications. On the basis of the spring-layer model, which is useful to treat the interfacial debonding and sliding, the present paper proposes a convenient method to assess the effects of delamination on the overall properties of composites. By applying the Equivalent Inclusion Method (EIM), two fundamental tensors are derived in the present model, the modified Eshelby tensor, and the compliance tensor (or stiffness tensor) of the weakened inclusions. Both of them are the fundamental tensors for constructing the overall constitutive law of composite materials. By simply substituting these tensors into an existing constitutive model, for instance, the Mori-Tanaka model, one can easily evaluate the effects of interfacial delamination on the overall properties of composite materials. Therefore, the present method offers a pretty convenient tool. Some numerical results are carried out in order to demonstrate the performance of this model.

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