Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films

2012 ◽  
Vol 59 ◽  
pp. 179-185 ◽  
Author(s):  
Nadiia Kulyk ◽  
Serhiy Cherevko ◽  
Chan-Hwa Chung
Keyword(s):  
Polymer Films ◽  
Electroless Plating ◽  
Reducing Agent ◽  
Weakly Alkaline ◽  
Alkaline Electrolytes

Electroless Plating of Honeycomb and Pincushion Polymer Films Prepared by Self-Organization

Langmuir ◽  
2006 ◽  
Vol 22 (23) ◽  
pp. 9760-9764 ◽  
Author(s):  
Hiroshi Yabu ◽  
Yuji Hirai ◽  
Masatsugu Shimomura
Keyword(s):  
Polymer Films ◽  
Electroless Plating ◽  
Self Organization

Study on Preparation of Ni/C Composite Powder by Electroless Plating Compound Complex Agent

2013 ◽  
Vol 709 ◽  
pp. 93-97
Author(s):  
Yan Jiang ◽  
Rui Min Xiao ◽  
Zi Jing Li ◽  
Li Da Sun ◽  
Du Shu Huang
Keyword(s):  
Electrical Properties ◽  
Hydrazine Hydrate ◽  
Rough Surface ◽  
Electroless Plating ◽  
Composite Powder ◽  
Reducing Agent ◽  
Optimum Conditions ◽  
Complex Agent

t is that Ni/C composite powder are prepared by electroless plating with hydrazine hydrate as a reducing agent and compound complex agent.To investigate the effect of main salts, reductant dosage, graphite dose and compound complex agent ratio on the conductivity of composite powder.It is can be obtained under optimum conditions with good electrical properties , the rough surface is completely coated Ni / C composite powder.

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