Estimating electrodeposition properties and processes: Cu-Ag alloy at n-Si(001) and Ru substrates from acidic sulfate bath

2021 ◽  
pp. 139695
Author(s):  
Wenbo Shao ◽  
Yunkai Sun ◽  
Walter Giurlani ◽  
Massimo Innocenti ◽  
Giovanni Zangari
1993 ◽  
Vol 109 (10) ◽  
pp. 791-795 ◽  
Author(s):  
Noboru MASUKO ◽  
Katsuhiko MUSHIAKE ◽  
Kazuo KOIKE

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Bijayalaxmi Panda

The effects of added chloride ion on copper electrodeposition was studied using Pb-Sb anode and a stainless steel cathode in an acidic sulfate bath containing added Co2+ ion. The presence of added chloride ion in the electrolyte solution containing 150 ppm of Co2+ ion was found to increase the anode and the cell potentials and decrease the cathode potential. Linear sweep voltammetry (LSV) was used to study the effects of added chloride ion on the anodic process during the electrodeposition of copper in the presence of added  ppm; the oxygen evolution potential is polarised by adding 10 ppm chloride ion at current densities (≥150 A/m2), and further increase in chloride ion concentration increases the polarisation of oxygen evolution reaction more at higher current densities. X-ray diffraction (XRD) showed that added chloride ion and added Co2+ ion changed the preferred crystal orientations of the copper deposits differently. Scanning electron microscopy (SEM) indicated that the surface morphology of the copper deposited in the presence of added chloride ion and added Co2+ ion has well-defined grains.


Coatings ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1563
Author(s):  
Wenbo Shao ◽  
Yunkai Sun ◽  
Giovanni Zangari

Electrodeposition of Cu-Ag films from acidic sulfate bath was conducted at n-Si(001) and polycrystalline Ru substrates. Significant nucleation overpotential of 0.4 V is observed with the Cu-Ag bath at n-Si(001) substrate, whereas the electrodeposition of Cu-Ag at Ru substrate is influenced by Ru oxides at the surface. Incomplete coverage of Si substrate by Cu-Ag deposit was observed from the deposition systems without Ag(I), or with 0.1 mM Ag(I), comparing with the compact Cu-Ag film obtained with the deposition bath containing 0.01 mM Ag(I). Layered and faceted Cu-Ag deposit was observed at small Cu deposition overpotential with the Ru substrate. Phase composition of the Cu-Ag deposits at n-Si(001) substrate from electrolyte with various Ag(I) concentrations is examined by XRD. Limited solubility of Ag (0.4 at.%) was observed in fcc-Cu until phase separation occurs. The classical model for nucleation kinetics in electrodeposition was used to examine the potentiostatic transients of the Cu-Ag electrodeposition at n-Si(001) substrate.


Author(s):  
Hayette Faid

AbstractIn this work, Zn-Ni alloys have been deposited on steel from sulfate bath, by electrodeposition method. The effect of Zn content on deposits properties was studied by cyclic voltammetry (CV), chronoaperometry (CA), linear stripping voltammetry (ALSV) and diffraction (XRD) and scanning electronic microscopy (SEM). The corrosion behavior in 3.5 wt. NaCl solution was examined using anodic polarization test and electrochemical impedance spectroscopy. X-ray diffraction of show that Zn-Ni alloys structure is composed of δ phase and γ phase, which increase with the decrease of Zn content in deposits. Results show that deposits obtained from bath less Zn2+ concentration exhibited better corrosion resistance.


2008 ◽  
Vol 14 (4) ◽  
pp. 507-514 ◽  
Author(s):  
Arvydas Survila ◽  
Dalia Bražinskienė ◽  
Stasė Kanapeckaitė ◽  
Zenius Mockus ◽  
Vitalija Jasulaitienė

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