Effect of tip clearance on the cooling performance of a microchannel heat sink

2004 ◽  
Vol 47 (5) ◽  
pp. 1099-1103 ◽  
Author(s):  
Jung Yim Min ◽  
Seok Pil Jang ◽  
Sung Jin Kim
2004 ◽  
Vol 127 (7) ◽  
pp. 770-779 ◽  
Author(s):  
Seok Pil Jang ◽  
Sung Jin Kim

In the present study, fluid-flow and heat-transfer characteristics of a microchannel heat sink subject to an impinging jet are experimentally investigated. In order to evaluate the cooling performance of a microchannel heat sink subject to an impinging jet under the condition of fixed pumping power, the pressure drop across the heat sink and temperature distributions at its base are measured. Specifically, a microthermal sensor array is fabricated and used to accurately measure temperature distributions at the base of the heat sink. Based on these experimental results, a correlation for the pressure drop across a microchannel heat sink subject to an impinging jet and a correlation for its thermal resistance are suggested. In addition, it is shown that the cooling performance of an optimized microchannel heat sink subject to an impinging jet is enhanced by about 21% compared to that of the optimized microchannel heat sink with a parallel flow under the fixed-pumping-power condition.


Author(s):  
Yanfeng Fan ◽  
Ibrahim Hassan

High heat fluxes have been created by the semiconductor devices due to the high power generation and shrank size. The large heat flux causes the circuit to exceed its allowable temperature and may experience both working efficiency loss and irreversible damage due to excess in their temperatures. In this paper, a swirl microchannel heat sink is designed to dissipate the large heat flux from the devices. The numerical simulation is carried out to investigate the cooling performance. Uniform heating boundary condition is applied and single phase water is selected as coolant. The present micro heat sink applies multiple swirl microchannels positioned in a circular flat plate to enhance the heat convection by creating the secondary flow at high Reynolds numbers. Copper is selected as the material of heat sink. The channel depth and width are fixed as 0.5 mm and 0.4 mm, respectively. The heat is injected into the system from the bottom of heat sink at the heat fluxes from 10 to 60 W/cm2. Flow is supplied from the top of micro heat sink through a jet hole with a diameter of 2 mm and enters swirl microchannels at the volume flow rates varying from 47 to 188 ml/min. The cooling performances of swirl microchannel heat sinks with different curvatures and channel numbers are evaluated based on the targets of low maximum temperature, temperature gradient and pressure drop.


2010 ◽  
Vol 46 (5) ◽  
pp. 549-553 ◽  
Author(s):  
Sadollah Ebrahimi ◽  
Jamshid Sabbaghzadeh ◽  
Maryamalsadat Lajevardi ◽  
Iraj Hadi

Author(s):  
Seok Pil Jang ◽  
Sung Jin Kim

In the present study fluid flow and heat transfer characteristics of a microchannel heat sink subject to an impinging jet are experimentally investigated. In order to evaluate the cooling performance of a microchannel heat sink subject to an impinging jet under the fixed pumping power condition, the pressure drop across a microchannel heat sink and temperature distributions at the base of it are measured. Especially, a micro-thermal sensor array is manufactured with simple and convenient microfabrication processes to measure temperature distributions at the base of the heat sink accurately. Based on these experimental results, we suggest a correlation for the pressure drop across a microchannel heat sink subject to an impinging jet as well as a correlation for the thermal resistance of that. In addition, we show that the cooling performance of a microchannel heat sink subject to an impinging jet is superior to that of the microchannel heat sink subject to a parallel flow.


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