Forced convection and heat transfer of water-cooled microchannel heat sinks with various structured metal foams

2017 ◽  
Vol 113 ◽  
pp. 1043-1053 ◽  
Author(s):  
Beibei Shen ◽  
Hongbin Yan ◽  
Bengt Sunden ◽  
Hongqian Xue ◽  
Gongnan Xie
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Metal Foams ◽  
Heat Sinks ◽  
Convection And Heat Transfer ◽  
Microchannel Heat Sinks

Enhanced Heat Transfer and Thermal Performance of Metal Foam Microchannel Heat Sinks With Internal Y-Shaped Bifurcation

2016 ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Bengt Sunden ◽  
Gongnan Xie
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Heat transfer enhancement in microchannel heat sinks using nanofluids

2012 ◽  
Vol 55 (9-10) ◽  
pp. 2559-2570 ◽  
Author(s):  
Tu-Chieh Hung ◽  
Wei-Mon Yan ◽  
Xiao-Dong Wang ◽  
Chun-Yen Chang
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks
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