Enhanced Heat Transfer and Thermal Performance of Metal Foam Microchannel Heat Sinks With Internal Y-Shaped Bifurcation

2016 ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Bengt Sunden ◽  
Gongnan Xie
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Enhanced Thermal Performance of Internal Y-Shaped Bifurcation Microchannel Heat Sinks With Metal Foams

2017 ◽  
Vol 10 (1) ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Hongbin Yan ◽  
Gongnan Xie ◽  
Bengt Sunden
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
High Power Density ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area, and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

EXPERIMENTAL STUDY OF FREE CONVECTION HEAT TRANSFER IN THE POROUS METAL-FOAM HEAT SINK

2013 ◽  
Vol 37 (3) ◽  
pp. 841-850 ◽  
Author(s):  
Tzer-Ming Jeng ◽  
Sheng-Chung Tzeng ◽  
Zhi-Ting Yeh
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Metal Foam ◽  
Convection Heat Transfer ◽  
Porous Metal ◽  
Metal Foams ◽  
Heat Sinks ◽  
Convection Heat ◽  
Pore Density ◽  
Free Convection Heat

This study experimentally investigated the free convection heat transfer characteristics of the annular metal-foam heat sinks. The results showed that the heat transfer coefficient (h) decreased as the pore density of metal foams increased when the thickness (tc) of the annular metal foams equaled 5 mm, but the (h) increased as the pore density increased when tc = 11 and 14.5 mm. Besides, the (h) increased firstly and then decreased as (tc) increased. There was better heat transfer effect when tc = 11 mm in the present study.

Heat transfer enhancement in microchannel heat sinks using nanofluids

2012 ◽  
Vol 55 (9-10) ◽  
pp. 2559-2570 ◽  
Author(s):  
Tu-Chieh Hung ◽  
Wei-Mon Yan ◽  
Xiao-Dong Wang ◽  
Chun-Yen Chang
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Jet Impingement Heat Transfer Enhancement by Packing High-Porosity Thin Metal Foams Between Jet Exit Plane and Target Surface

2019 ◽  
Vol 11 (6) ◽  
Author(s):  
Srivatsan Madhavan ◽  
Prashant Singh ◽  
Srinath Ekkad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Metal Foam ◽  
Jet Impingement ◽  
Target Surface ◽  
Metal Foams ◽  
Thin Metal ◽  
High Porosity ◽  
Pumping Power ◽  
Transfer Enhancement

High-porosity metal foams are known for providing high heat transfer rates, as they provide a significant increase in wetted surface area as well as highly tortuous flow paths resulting in enhanced mixing. Further, jet impingement offers high convective cooling, particularly at the jet footprint areas on the target surface due to flow stagnation. In this study, high-porosity thin metal foams were subjected to array jet impingement, for a special crossflow scheme. High porosity (92.65%), high pore density (40 pores per inch (ppi)), and thin foams (3 mm) have been used. In order to reduce the pumping power requirements imposed by full metal foam design, two striped metal foam configurations were also investigated. For that, the jets were arranged in 3 × 6 array (x/dj = 3.42, y/dj = 2), such that the crossflow is dominantly sideways. Steady-state heat transfer experiments have been conducted for varying jet-to-target plate distance z/dj = 0.75, 2, and 4 for Reynolds numbers ranging from 3000 to 12,000. The baseline case was jet impingement onto a smooth target surface. Enhancement in heat transfer due to impingement onto thin metal foams has been evaluated against the pumping power penalty. For the case of z/dj = 0.75 with the base surface fully covered with metal foam, an average heat transfer enhancement of 2.42 times was observed for a concomitant pressure drop penalty of 1.67 times over the flow range tested.

Enhanced Thermal Transport in Microchannel Using Oblique Fins

2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

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