Heat transfer enhancement of symmetric and parallel wavy microchannel heat sinks with secondary branch design

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

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Heat transfer enhancement by silver nanowire suspensions in microchannel heat sinks

International Journal of Thermal Sciences ◽

10.1016/j.ijthermalsci.2017.08.021 ◽

2018 ◽

Vol 123 ◽

pp. 1-13 ◽

Cited By ~ 18

Author(s):

Eylül Şimşek ◽

Sahin Coskun ◽

Tuba Okutucu-Özyurt ◽

Husnu Emrah Unalan

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Silver Nanowire ◽

Heat Sinks ◽

Transfer Enhancement ◽

Microchannel Heat Sinks

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A 3D inlet distributor employing copper foam for liquid replenishment and heat transfer enhancement in microchannel heat sinks

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2020.119934 ◽

2020 ◽

Vol 157 ◽

pp. 119934

Author(s):

Sihui Hong ◽

Chaobin Dang ◽

Eiji Hihara

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Heat Sinks ◽

Transfer Enhancement ◽

Copper Foam ◽

Microchannel Heat Sinks

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Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling Application

10.5772/intechopen.97087 ◽

2021 ◽

Author(s):

Naga Ramesh Korasikha ◽

Thopudurthi Karthikeya Sharma ◽

Gadale Amba Prasad Rao ◽

Kotha Madhu Murthy

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Power Density ◽

High Power ◽

Performance Enhancement ◽

Electronic Cooling ◽

Heat Sinks ◽

High Power Density ◽

Transfer Enhancement ◽

Microchannel Heat Sinks

Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capacity. Microchannel heat sinks (MCHS) are the most suitable heat exchanging devices for electronic cooling applications with high compactness. The heat transfer enhancement of the microchannel heat sinks (MCHS) is the most focused research area. Huge research has been done on the thermal and hydraulic performance enhancement of the microchannel heat sinks. This chapter’s focus is on advanced heat transfer enhancement methods used in the recent studies for the MCHS. The present chapter gives information about the performance enhancement MCHS with geometry modifications, Jet impingement, Phase changing materials (PCM), Nanofluids as a working fluid, Flow boiling, slug flow, and magneto-hydrodynamics (MHD).

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