Pseudo 3D topology optimization of microchannel heat sink with an auxiliary objective

Author(s):  
Pingnan Huang ◽  
Shu Yang ◽  
Minqiang Pan
2018 ◽  
Vol 140 (3) ◽  
Author(s):  
Yuki Sato ◽  
Kentaro Yaji ◽  
Kazuhiro Izui ◽  
Takayuki Yamada ◽  
Shinji Nishiwaki

This paper proposes an optimum design method for a two-dimensional microchannel heat sink under a laminar flow assumption that simultaneously provides maximal heat exchange and minimal pressure drop, based on a topology optimization method incorporating Pareto front exploration. First, the formulation of governing equations for the coupled thermal-fluid problem and a level set-based topology optimization method are briefly discussed. Next, an optimum design problem for a microchannel heat sink is formulated as a bi-objective optimization problem. An algorithm for Pareto front exploration is then constructed, based on a scheme that adaptively determines weighting coefficients by solving a linear programming problem. Finally, in the numerical example, the proposed method yields a Pareto front approximation and enables the analysis of the trade-off relationship between heat exchange and pressure drop, confirming the utility of the proposed method.


2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.


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