scholarly journals Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling Application

2021 ◽  
Author(s):  
Naga Ramesh Korasikha ◽  
Thopudurthi Karthikeya Sharma ◽  
Gadale Amba Prasad Rao ◽  
Kotha Madhu Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Power Density ◽  
High Power ◽  
Performance Enhancement ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
High Power Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capacity. Microchannel heat sinks (MCHS) are the most suitable heat exchanging devices for electronic cooling applications with high compactness. The heat transfer enhancement of the microchannel heat sinks (MCHS) is the most focused research area. Huge research has been done on the thermal and hydraulic performance enhancement of the microchannel heat sinks. This chapter’s focus is on advanced heat transfer enhancement methods used in the recent studies for the MCHS. The present chapter gives information about the performance enhancement MCHS with geometry modifications, Jet impingement, Phase changing materials (PCM), Nanofluids as a working fluid, Flow boiling, slug flow, and magneto-hydrodynamics (MHD).

Heat transfer enhancement in microchannel heat sinks using nanofluids

2012 ◽  
Vol 55 (9-10) ◽  
pp. 2559-2570 ◽  
Author(s):  
Tu-Chieh Hung ◽  
Wei-Mon Yan ◽  
Xiao-Dong Wang ◽  
Chun-Yen Chang
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Enhanced Thermal Transport in Microchannel Using Oblique Fins

2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

Heat Transfer Enhancement in the Heat Sinks for Electronic Cooling Applications

2005 ◽  
Author(s):  
Evan Small ◽  
Sadegh M. Sadeghipour ◽  
Mehdi Asheghi
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Engineering Students ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Optimum Number ◽  
Transfer Enhancement

In a design competition by the mechanical engineering students at Carnegie Mellon University, which was the design of heat sinks for electronic cooling applications, twenty seven heat sinks were designed and tested for thermal performance. A heat sink with three rows of 9, 8, and 9 dimpled rectangular fins (staggered configuration) demonstrated the best performance in the test. This heat sink even had the least total volume (about 25% less than the set value). This paper reports on an effort made to verify and quantify the role of dimples on heat transfer enhancement of the heat sinks. This includes measurements and simulations of the thermal fluid properties of the heat sinks with and without dimples. Results of both the measurements and simulations indicate that dimples do in fact improve heat transfer capability of the heat sinks. Albeit, dimpled fins cause more pressure drop in air along the heat sink. Keeping the total volume of the heat sink and the height of the fins constant and changing the number of the fins and their arrangement show that there exist an optimum number of fins for the best performance of the heat sink. However, this number of fins is different for inline and staggered arrangements. To check the role of the roughness type on the heat transfer behavior of the fins, a heat sink with twenty-seven bumped fins with inline arrangement was also simulated. Results indicated that bumps increase both thermal resistance and pressure drop relative to that of the heat sinks with plain fins.

Microchannel heat sinks for two-dimensional high-power-density diode laser arrays

1989 ◽  
Vol 25 (9) ◽  
pp. 1988-1992 ◽  
Author(s):  
L.J. Missaggia ◽  
J.N. Walpole ◽  
Z.L. Liau ◽  
R.J. Phillips
Keyword(s):  
Diode Laser ◽  
Power Density ◽  
High Power ◽  
Heat Sinks ◽  
High Power Density ◽  
Two Dimensional ◽  
Laser Arrays ◽  
Microchannel Heat Sinks
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