Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

2007 ◽  
Vol 15 (3) ◽  
pp. 396-403 ◽  
Author(s):  
Riet Labie ◽  
Wouter Ruythooren ◽  
Jan Van Humbeeck
Keyword(s):  
Solid State ◽  
Flip Chip ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion

Investigation of the diffusion behavior in Sn-xAg-yCu/Cu solid state diffusion couples

2016 ◽  
Vol 686 ◽  
pp. 794-802 ◽  
Author(s):  
Yuan Yuan ◽  
Dajian Li ◽  
Yuanyuan Guan ◽  
Hans J. Seifert ◽  
Nele Moelans
Keyword(s):  
Solid State ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
Diffusion Behavior ◽  
State Diffusion

Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

1993 ◽  
Vol 323 ◽  
Author(s):  
Alan J. Mockler ◽  
Peter J. Goodhew ◽  
Elizabeth A. Logan
Keyword(s):  
Heat Treatment ◽  
Solid State ◽  
Ternary Phase ◽  
Flip Chip ◽  
Phase Distribution ◽  
Intermetallic Phases ◽  
Ternary Diagram ◽  
Solid State Diffusion ◽  
Analysis Techniques ◽  
State Diffusion

AbstractThe microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

Growth kinetics of phases in solid-state diffusion couples

1995 ◽  
Vol 152 (2) ◽  
pp. 385-392 ◽  
Author(s):  
V. H. Garcia ◽  
C. Scherer ◽  
P. M. Mors
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion ◽  
Kinetics Of

scholarly journals Investigation of diffusion behavior in Cu–Sn solid state diffusion couples

2016 ◽  
Vol 661 ◽  
pp. 282-293 ◽  
Author(s):  
Yuan Yuan ◽  
Yuanyuan Guan ◽  
Dajian Li ◽  
Nele Moelans
Keyword(s):  
Solid State ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
Diffusion Behavior ◽  
State Diffusion

Joining of Ti3SiC2 with Ti–6Al–4V Alloy

2002 ◽  
Vol 17 (1) ◽  
pp. 52-59 ◽  
Author(s):  
N.F. Gao ◽  
Y. Miyamoto
Keyword(s):  
Solid State ◽  
Rate Constant ◽  
Liquid State ◽  
Parabolic Rate Constant ◽  
Diffusion Path ◽  
Solid State Diffusion ◽  
Diffusion Controlled ◽  
State Diffusion ◽  
Rate Controlled ◽  
Higher Temperature

The joining of a Ti3SiC2 ceramic with a Ti–6Al–4V alloy was carried out at the temperature range of 1200–1400 °C for 15 min to 4 h in a vacuum. The total diffusion path of joining was determined to be Ti3SiC2/Ti5Si3Cx/Ti5Si3Cx + TiCx/TiCx/Ti. The reaction was rate controlled by the solid-state diffusion below 1350 °C and turned to the liquid-state diffusion controlled with a dramatic increase of parabolic rate constant Kp when the temperature exceeded 1350 °C. The TiCx tended to grow at the boundarywith the Ti–6Al–4V alloy at a higher temperature and longer holding time. TheTi3SiC2/Ti–6Al–4V joint is expected to be applied to implant materials.

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