Investigation of the diffusion behavior in Sn-xAg-yCu/Cu solid state diffusion couples

2016 ◽  
Vol 686 ◽  
pp. 794-802 ◽  
Author(s):  
Yuan Yuan ◽  
Dajian Li ◽  
Yuanyuan Guan ◽  
Hans J. Seifert ◽  
Nele Moelans
Keyword(s):  
Solid State ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
Diffusion Behavior ◽  
State Diffusion

scholarly journals Investigation of diffusion behavior in Cu–Sn solid state diffusion couples

2016 ◽  
Vol 661 ◽  
pp. 282-293 ◽  
Author(s):  
Yuan Yuan ◽  
Yuanyuan Guan ◽  
Dajian Li ◽  
Nele Moelans
Keyword(s):  
Solid State ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
Diffusion Behavior ◽  
State Diffusion

Interfacial Microstructure Investigation of Diffusion Bonded New Ni-Cr-W Superalloy Using Cu Interlayer

2013 ◽  
Vol 634-638 ◽  
pp. 1844-1849 ◽  
Author(s):  
Rui Hu ◽  
Xian Lin Meng ◽  
Bin Tang ◽  
Chuan Yun Wang ◽  
Hong Chao Kou ◽  
...  
Keyword(s):  
Solid State ◽  
Bonding Temperature ◽  
Interfacial Microstructure ◽  
Vacuum Furnace ◽  
Solid State Diffusion ◽  
Diffusion Behavior ◽  
State Diffusion ◽  
Different Temperatures ◽  
Cu Foil ◽  
Cu Interlayer

The solid-state diffusion bonding processes were successfully carried out to join new Ni-Cr-W superalloys at different temperatures (850°C-950°C), under pressures of 20MPa and holding 45min in a vacuum furnace by taking Cu foil as interlayer. The influence of bonding temperature on the microstructural evolution and the diffusion behavior across the joints was investigated in details. Results indicate that the Ni-Cu solid solutions in the interface lead to a sound bonding interface without any void or impurity. As the temperature increases, the reaction layers become thicker due to the decrease of M23C6 precipitation in the grain boundaries and the rise of atoms diffusion capability. Furthermore, hardness measuremental result also reveals that the increased thickness of reaction layers cannot improve the microhardness of bonding interfaces apparently.

Growth kinetics of phases in solid-state diffusion couples

1995 ◽  
Vol 152 (2) ◽  
pp. 385-392 ◽  
Author(s):  
V. H. Garcia ◽  
C. Scherer ◽  
P. M. Mors
Keyword(s):  
Solid State ◽  
Growth Kinetics ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion ◽  
Kinetics Of

Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

2007 ◽  
Vol 15 (3) ◽  
pp. 396-403 ◽  
Author(s):  
Riet Labie ◽  
Wouter Ruythooren ◽  
Jan Van Humbeeck
Keyword(s):  
Solid State ◽  
Flip Chip ◽  
Solid State Diffusion ◽  
Diffusion Couples ◽  
State Diffusion

Joining of Ti3SiC2 with Ti–6Al–4V Alloy

2002 ◽  
Vol 17 (1) ◽  
pp. 52-59 ◽  
Author(s):  
N.F. Gao ◽  
Y. Miyamoto
Keyword(s):  
Solid State ◽  
Rate Constant ◽  
Liquid State ◽  
Parabolic Rate Constant ◽  
Diffusion Path ◽  
Solid State Diffusion ◽  
Diffusion Controlled ◽  
State Diffusion ◽  
Rate Controlled ◽  
Higher Temperature

The joining of a Ti3SiC2 ceramic with a Ti–6Al–4V alloy was carried out at the temperature range of 1200–1400 °C for 15 min to 4 h in a vacuum. The total diffusion path of joining was determined to be Ti3SiC2/Ti5Si3Cx/Ti5Si3Cx + TiCx/TiCx/Ti. The reaction was rate controlled by the solid-state diffusion below 1350 °C and turned to the liquid-state diffusion controlled with a dramatic increase of parabolic rate constant Kp when the temperature exceeded 1350 °C. The TiCx tended to grow at the boundarywith the Ti–6Al–4V alloy at a higher temperature and longer holding time. TheTi3SiC2/Ti–6Al–4V joint is expected to be applied to implant materials.

Sign in / Sign up

Export Citation Format

Share Document