A bottom–up multiscale view of point-defect aggregation in silicon

2007 ◽  
Vol 303 (1) ◽  
pp. 5-11 ◽  
Author(s):  
Talid Sinno
2019 ◽  
Vol 2 (2) ◽  
pp. 77-88 ◽  
Author(s):  
Talid Sinno ◽  
Walter Haeckl ◽  
Wilfried von Ammon

1996 ◽  
Vol 36 (1-3) ◽  
pp. 33-41 ◽  
Author(s):  
W.v. Ammon ◽  
P. Dreier ◽  
W. Hensel ◽  
U. Lambert ◽  
L. Köster

Author(s):  
M. Awaji

It is necessary to improve the resolution, brightness and signal-to-noise ratio(s/n) for the detection and identification of point defects in crystals. In order to observe point defects, multi-beam dark-field imaging is one of the useful methods. Though this method can improve resolution and brightness compared with dark-field imaging by diffuse scattering, the problem of s/n still exists. In order to improve the exposure time due to the low intensity of the dark-field image and the low resolution, we discuss in this paper the bright-field high-resolution image and the corresponding subtracted image with reference to a changing noise level, and examine the possibility for in-situ observation, identification and detection of the movement of a point defect produced in the early stage of damage process by high energy electron bombardment.The high-resolution image contrast of a silicon single crystal in the [10] orientation containing a triple divacancy cluster is calculated using the Cowley-Moodie dynamical theory and for a changing gaussian noise level. This divacancy model was deduced from experimental results obtained by electron spin resonance. The calculation condition was for the lMeV Berkeley ARM operated at 800KeV.


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