Formation of V-grooves on the (Al,Ga)N surface as means of tensile stress relaxation

2012 ◽  
Vol 353 (1) ◽  
pp. 88-94 ◽  
Author(s):  
Kai Cheng ◽  
M. Leys ◽  
S. Degroote ◽  
H. Bender ◽  
P. Favia ◽  
...  
1996 ◽  
Vol 436 ◽  
Author(s):  
J. P. Lokker ◽  
J. F. Jongste ◽  
G. C. A. M. Janssen ◽  
S. Radelaar

AbstractMechanical stress and its relaxation in aluminum metallization in integrated circuits (IC) are a major concern for the reliability of the material. It is known that adding Cu improves the reliability but complicates plasma etching and increases corrosion sensitivity. The mechanical behavior of AlVPd, AlCu and Al blanket films is investigated by wafer curvature measurements. During thermal cycling between 50°C and 400°C the highest tensile stress is found in AlVPd. In a subsequent experiment, the cooling was interrupted at several temperatures to investigate the stress behavior during an eight hour isothermal treatment. Isothermal stress relaxation has been observed in the three types of films and is discussed.


1962 ◽  
Vol 17 (8) ◽  
pp. 726-748 ◽  
Author(s):  
Kiyohisa Fujino ◽  
Kazuo Senshu ◽  
Tzuneo Horino ◽  
Hiromichi Kawai

Holzforschung ◽  
2010 ◽  
Vol 64 (1) ◽  
Author(s):  
Lili Yu ◽  
Jinzhen Cao ◽  
Guangjie Zhao

Abstract The reactions between constituents of alkaline copper quat (ACQ) and of wood were investigated by a tensile stress relaxation approach. Small samples were stressed and impregnated with various ACQ solutions, in which the ratios of monoethanolamine (MEA), ACQ, and didecyl dimethyl ammonium chloride (DDAC) were varied. The other parameters included temperature and concentration of the treating solutions. The stress relaxation curves of wood were recorded during the impregnation period and the effects of impregnation parameters were investigated by an orthogonal experimental design (OED). The effects of water, MEA, and DDAC on stress relaxation of the samples were also observed. The bulking effect of water was tested separately in samples treated with distilled water without stretching. The results showed that the stress relaxes dramatically in the initial period and then changes slightly over a long period, which is readily visible in double logarithmic plots of f (t)/f (0) versus time (t). There are complex interactions between the components of ACQ solutions and wood matrix: (1) in rapid phase I, the splitting of the easily accessible hydrogen bonds (mainly in the amorphous hemicelluloses) are prevalent by interaction with components of ACQ solution; (2) in slow phase II, Cu penetrates deeper in less accessible regions (e.g., in paracrystalline regions of cellulose) and renders possible further relaxation. The results of range and variance analysis reveal that the molar ratio of Cu to MEA and temperature of ACQ solution have significant effects on the rate of reaction during phase I, whereas in phase II only the temperature of ACQ solution has a significant effect. The stress relaxation curves of samples impregnated in water, MEA, and DDAC all showed a quasi one phase stress relaxation rate, which suggests that phase II is mostly related to Cu in ACQ formulations. It is concluded that the formation of complexes with Cu is still the major reaction in wood although there is competition among ACQ constituents for reaction sites.


2006 ◽  
Vol 38 (1) ◽  
pp. 84-91 ◽  
Author(s):  
G. V. Stepanov ◽  
A. I. Babutskii ◽  
I. A. Mameev ◽  
A. N. Olisov

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