Dielectric properties of SrTiO3/POE flexible composites for microwave applications

2007 ◽  
Vol 27 (8-9) ◽  
pp. 3093-3097 ◽  
Author(s):  
Feng Xiang ◽  
Hong Wang ◽  
Xi Yao
Keyword(s):  
Dielectric Properties ◽  
Flexible Composites ◽  
Microwave Applications

Dielectric properties of srtio3 thin films with ca and zr partial substitutions for active microwave applications

1997 ◽  
Vol 15 (1-4) ◽  
pp. 173-180 ◽  
Author(s):  
L. A. Knauss ◽  
J. S. Horwitz ◽  
J. M. Pond ◽  
S. W. Kirchoefer ◽  
D. B. Chrisey ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Properties ◽  
Microwave Applications

Dielectric properties of B2O3-doped 0.92(Mg0.95Co0.05)2TiO4–0.08(Ca0.8Sr0.2)TiO3 ceramics for microwave applications

2010 ◽  
Vol 505 (1) ◽  
pp. 291-296 ◽  
Author(s):  
Bing-Jing Li ◽  
Jhih-Yong Chen ◽  
Guan-Sian Huang ◽  
Chang-Yang Jiang ◽  
Cheng-Liang Huang
Keyword(s):  
Dielectric Properties ◽  
Microwave Applications

DIELECTRIC PROPERTIES OF PARAELECTRIC Ba(Zr,Ti)O 3 THIN FILMS FOR TUNABLE MICROWAVE APPLICATIONS

2005 ◽  
Vol 77 (1) ◽  
pp. 93-99 ◽  
Author(s):  
SU-JAE LEE ◽  
MIN-HWAN KWAK ◽  
SEUNG EON MOON ◽  
HAN-CHEOL RYU ◽  
YOUNG-TAE KIM ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Properties ◽  
Tunable Microwave ◽  
Microwave Applications

Dielectric properties and tunability of BST and BZT thick films for microwave applications

2001 ◽  
Vol 39 (1-4) ◽  
pp. 383-392 ◽  
Author(s):  
Michael Voigts ◽  
Wolfgang Menesklou ◽  
Ellen Ivers-Tiffee
Keyword(s):  
Dielectric Properties ◽  
Thick Films ◽  
Microwave Applications

Dielectric Properties and Microstructure of BaO-Nd2O3-Bi2O3-TiO2 Microwave Ceramics with Li2O-B2O3-SiO2

2014 ◽  
Vol 906 ◽  
pp. 12-17
Author(s):  
Yong Gang Zhang ◽  
Xiao Gang Wu
Keyword(s):  
Dielectric Properties ◽  
Low Temperature ◽  
Physical Properties ◽  
Sintering Temperature ◽  
Microwave Ceramics ◽  
Passive Components ◽  
Glass Composites ◽  
Ceramic Glass ◽  
Microwave Applications ◽  
Low Sintering Temperature

Low temperature co-fired ceramics (LTCC) technology becomes crucial in the development of various modules and substrates in electronic packaging, especially in wireless and microwave applications [. With this technology, passive components (such as capacitors and inductors) can be embedded into substrates, and co-fired with high-conductive metals (such as silver and copper) below 900°C. Therefore, the shringkage and dielectric properties of LTCC are of great importance to the performance of components. So far, ceramic/glass composites have been widely researched for LTCC application due to tailored physical properties and low sintering temperature [2-3].

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