Conversion of bromine during thermal decomposition of printed circuit boards at high temperature

2011 ◽  
Vol 186 (1) ◽  
pp. 707-712 ◽  
Author(s):  
Yu-qi Jin ◽  
Lin Tao ◽  
Yong Chi ◽  
Jian-hua Yan
Keyword(s):  
Thermal Decomposition ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

High Temperature Laminate Characterization

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000235-000245
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Model Development ◽  
Peel Strength ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Mean Lifetime ◽  
The Mean

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization and modeling high temperature laminates for application at 200 to 250°C was conducted to better quantify the mean lifetime using accelerated testing of key functional parameters. Life testing and model development was applied for via cyclic life, peel strength, and weight loss. Four high temperature laminates consisting of 2 types were evaluated. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples.

High temperature investigations on optimising the recovery of copper from waste printed circuit boards

2018 ◽  
Vol 73 ◽  
pp. 556-565 ◽  
Author(s):  
R. Cayumil ◽  
M. Ikram-Ul-Haq ◽  
R. Khanna ◽  
R. Saini ◽  
P.S. Mukherjee ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

2012 ◽  
Vol 32 (3) ◽  
pp. 568-574 ◽  
Author(s):  
Mingjiang Ni ◽  
Hanxi Xiao ◽  
Yong Chi ◽  
Jianhua Yan ◽  
Alfons Buekens ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
High Temperature Furnace ◽  
Temperature Furnace

scholarly journals Evaluation of printed-circuit boards materials for high temperature operation

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000057-000062
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

ABSTRACT This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190 °C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling.

Concentration of rare earth elements during high temperature pyrolysis of waste printed circuit boards

2018 ◽  
Vol 78 ◽  
pp. 602-610 ◽  
Author(s):  
R. Khanna ◽  
G. Ellamparuthy ◽  
R. Cayumil ◽  
S.K. Mishra ◽  
P.S. Mukherjee
Keyword(s):  
Rare Earth ◽  
High Temperature ◽  
Rare Earth Elements ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

Reliability of High Temperature Laminates

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000100-000110 ◽  
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Peel Strength ◽  
Circuit Boards ◽  
Cyclic Life ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization of high temperature laminates for application at 200 to 250°C was conducted to better quantify their lifetime using accelerated testing of key functional parameters. Eight high temperature laminates consisting of 3 material types was evaluated. Life testing was applied for via cyclic life, weight loss, peel strength, and surface insulation resistance. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Weight loss was measured at intervals during the life of the tests. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples. The non-polyimide laminates exhibited the longer life times than polyimide laminates in most tests except peel strength. Peel strength is the life limiting parameter for the laminates. Parylene HT was found to improve stability in peel strength and weight loss of one PTFE laminate tested.

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