High Temperature Laminate Characterization

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000235-000245
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Model Development ◽  
Peel Strength ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Mean Lifetime ◽  
The Mean

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization and modeling high temperature laminates for application at 200 to 250°C was conducted to better quantify the mean lifetime using accelerated testing of key functional parameters. Life testing and model development was applied for via cyclic life, peel strength, and weight loss. Four high temperature laminates consisting of 2 types were evaluated. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples.

Reliability of High Temperature Laminates

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000100-000110 ◽  
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Printed Circuit Boards ◽  
Stress Test ◽  
Peel Strength ◽  
Circuit Boards ◽  
Cyclic Life ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Printed circuit boards have been reported to have limited lifetime at 200 to 250°C. Characterization of high temperature laminates for application at 200 to 250°C was conducted to better quantify their lifetime using accelerated testing of key functional parameters. Eight high temperature laminates consisting of 3 material types was evaluated. Life testing was applied for via cyclic life, weight loss, peel strength, and surface insulation resistance. Via lifetime was characterization using Interconnect Stress Test (IST) coupons. Weight loss was measured at intervals during the life of the tests. Peel strength was tested using IPC IPC-TM-650 method 2.4.8c. Weight loss was characterized using isothermal aging. Comparison of lifetime is made between the laminate samples. The non-polyimide laminates exhibited the longer life times than polyimide laminates in most tests except peel strength. Peel strength is the life limiting parameter for the laminates. Parylene HT was found to improve stability in peel strength and weight loss of one PTFE laminate tested.

High Temperature Laminate Characterization

2014 ◽  
Vol 11 (4) ◽  
pp. 146-157 ◽  
Author(s):  
David Shaddock ◽  
Liang Yin
Keyword(s):  
Weight Loss ◽  
High Temperature ◽  
Flame Retardant ◽  
Peel Strength ◽  
Insulation Resistance ◽  
Life Testing ◽  
Cyclic Life ◽  
Surface Insulation Resistance ◽  
Mean Lifetime ◽  
The Mean

Characterization and modeling of high-temperature laminates for application at 200–250°C is reported to compare and better quantify the mean lifetime based on key functional parameters of via cycling, weight loss, peel strength, and surface insulation resistance (SIR). Life testing and models are applied for via cyclic life, peel strength, and weight loss. Five high-temperature laminates, consisting of three polyimides and two nonpolyimides, were evaluated. The polyimide laminates behaved similarly in via, weight loss, peel strength, and SIR testing with small variances. The nonpolyimides performed longer in via and weight loss. They degraded more rapidly than the polyimides in peel strength and failed in SIR, due to its flame retardant. A comparison of lifetime among the five laminates is presented.

Influence of nucleating agent type on the morphology of extruded polyetherimide foam for printed circuit boards*

2019 ◽  
Vol 56 (3) ◽  
pp. 317-341 ◽  
Author(s):  
Clemens Keilholz ◽  
Daniel Raps ◽  
Thomas Köppl ◽  
Volker Altstädt
Keyword(s):  
Surface Tension ◽  
Printed Circuit Boards ◽  
Particle Diameter ◽  
Nucleating Agent ◽  
Nucleating Agents ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Foam Morphology ◽  
The Mean ◽  
Mean Particle Diameter

This work focuses on the development of foamed high temperature thermoplastic substrates for printed circuit boards. For this application it is necessary to achieve mean cell diameters smaller than 30 µm in order to be able to realize vias and high packaging densities (miniaturization). Different additives as nucleating agents, namely macro- and micro-crystalline talc, silica, calcium carbonate, and wollastonite, were melt-compounded with polyetherimide using a twin-screw extruder. Foamed samples are prepared by foam extrusion using a slit die and CO2 as physical blowing agent. The aim of this study is to analyze the influence of the mean particle size and the particle surface tension on the mean cell diameters. Therefore, the shape of the additives, the foam morphology, and the elongational viscosity were considered. The additives with a suitable particle size and surface tension exhibit a positive influence on the foam morphology, resulting in smaller cell diameters (<30 µm), a narrower cell size distribution and a foam density lower than 900 kg/m3. If the mean particle diameter of the nucleating agents is lower than 0.6 µm in this study, no nucleation effect could be observed. This is related to the fact that no heterogeneous nucleation occurs, if the particle diameter is too small. If the mean particle diameter of the used additives is larger than 1.5 µm, which could be demonstrated in this study in case of polyetherimide, then the additive acts as nucleating agent and heterogeneous nucleation occurs. Furthermore, it was observed that the mean cell diameter was affected by the different surface tensions of the studied nucleating agents.

High temperature investigations on optimising the recovery of copper from waste printed circuit boards

2018 ◽  
Vol 73 ◽  
pp. 556-565 ◽  
Author(s):  
R. Cayumil ◽  
M. Ikram-Ul-Haq ◽  
R. Khanna ◽  
R. Saini ◽  
P.S. Mukherjee ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

2012 ◽  
Vol 32 (3) ◽  
pp. 568-574 ◽  
Author(s):  
Mingjiang Ni ◽  
Hanxi Xiao ◽  
Yong Chi ◽  
Jianhua Yan ◽  
Alfons Buekens ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
High Temperature Furnace ◽  
Temperature Furnace

scholarly journals Evaluation of printed-circuit boards materials for high temperature operation

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000057-000062
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

ABSTRACT This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190 °C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling.

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