Ultrafast pulse laser inscription and surface quality characterization of micro-structured silicon wafer

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

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Characterization of the Surface Quality by Means of Surface Potential Difference

Surface Contamination ◽

10.1007/978-1-4684-3509-2_14 ◽

1979 ◽

pp. 723-748 ◽

Cited By ~ 3

Author(s):

P. F. A. Bijlmer

Keyword(s):

Surface Quality ◽

Surface Potential ◽

Potential Difference

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Surface quality characterization of textile-reinforced thermoplastics

Polymer Composites ◽

10.1002/pc.10218 ◽

2000 ◽

Vol 21 (4) ◽

pp. 630-635 ◽

Cited By ~ 20

Author(s):

M. Neitzel ◽

M. Blinzler ◽

K. Edelmann ◽

F. Hoecker

Keyword(s):

Surface Quality ◽

Reinforced Thermoplastics

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Fabrication of Ultra Thick Ferromagnetic Structures in Silicon

Microelectromechanical Systems ◽

10.1115/imece2004-61909 ◽

2004 ◽

Cited By ~ 1

Author(s):

Debbie G. Jones ◽

Albert P. Pisano

Keyword(s):

Electron Microscopy ◽

Thin Films ◽

Scanning Electron Microscopy ◽

Saturation Magnetization ◽

Silicon Wafer ◽

Fabrication Process ◽

Sem Images ◽

Deep Reactive Ion Etching ◽

Scanning Electron

A novel fabrication process is presented to create ultra thick ferromagnetic structures in silicon. The structures are fabricated by electroforming NiFe into silicon templates patterned with deep reactive ion etching (DRIE). Thin films are deposited into photoresist molds for characterization of an electroplating cell. Results show that electroplated films with a saturation magnetization above 1.6 tesla and compositions of approximately 50/50 NiFe can be obtained through agitation of the electrolyte. Scanning electron microscopy (SEM) images show that NiFe structures embedded in a 500 μm thick silicon wafer are realized and the roughening of the mold sidewalls during the DRIE aids in adhesion of the NiFe to the silicon.

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