Effect of Xe26+ ion irradiation on the microstructural evolution and mechanical properties of Zr–1Nb at room and high temperature

2015 ◽  
Vol 461 ◽  
pp. 78-84 ◽  
Author(s):  
Chunguang Yan ◽  
Rongshan Wang ◽  
Yanli Wang ◽  
Xitao Wang ◽  
Guanghai Bai ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Microstructural Evolution ◽  
Ion Irradiation

scholarly journals High-temperature microstructural evolution and room-temperature mechanical properties of friction-stir-processed 5083 aluminum alloy

2017 ◽  
Vol 67 (8) ◽  
pp. 361-366
Author(s):  
Takashi Mizuguchi ◽  
Tsutomu Ito ◽  
Kota Kimura ◽  
Tokiko Kurisaka ◽  
Hiroaki Ohfuji ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aluminum Alloy ◽  
High Temperature ◽  
Microstructural Evolution ◽  
Room Temperature ◽  
Friction Stir ◽  
5083 Aluminum Alloy

Microstructural Evolution, Room‐ and High‐Temperature Mechanical Properties of Friction Welded Joints of a New Wrought Ni–Fe Based Superalloy

2019 ◽  
Vol 21 (8) ◽  
pp. 1900267
Author(s):  
Yaxin Xu ◽  
Wenya Li ◽  
Jintao Lu ◽  
Guilong Wang ◽  
Yingying Dang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Microstructural Evolution ◽  
Welded Joints ◽  
High Temperature Mechanical Properties

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

2019 ◽  
Author(s):  
S. M. Kamrul Hasan ◽  
Abdullah Fahim ◽  
Jeffrey C. Suhling ◽  
Sa’d Hamasha ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Elastic Modulus ◽  
High Temperature ◽  
Thermal Cycling ◽  
Microstructural Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Extreme ◽  
Aging Effects ◽  
Free Solder

Abstract Lead free electronic assemblies are often subjected to thermal cycling during qualification testing or during actual use. The dwell periods at the high temperature extreme during thermal cycling cause thermal aging phenomena in the solder material, including microstructural evolution and material property degradation. In addition, lead free solders can also experience aging effects during the ramp periods between the low and high temperature extremes of the cycling. In this study, the mechanical behavior evolution occurring in SAC305 lead free solder subjected to various thermal cycling exposures has been investigated. Uniaxial test specimens were prepared by reflowing solder in rectangular cross-section glass tubes with a controlled temperature profile. After reflow solidification, the samples were placed into the environmental chamber and thermally cycled from −40 C to +125 C under a stress-free condition (no load). Several thermal cycling profiles were examined including: (1) 90 minute cycles with 15 minutes ramps and 30 minutes dwells, (2) air-to-air thermal shock exposures with 30 minutes dwells and near instantaneous ramps, (3) 30 minute cycles with 15 minutes ramps and no dwells (saw tooth profile), (4) 150 minute cycles with 45 minutes ramps and 30 minutes dwells, and (5) no cycling (simple aging at the high temperature extreme). For each profile, 10–15 samples were cycled for various durations of cycling (e.g. 48, 96, and 240 cycles), which were equivalent to various aging times at the high temperature extreme of T = 125 C. After cycling, the stress-strain curves and mechanical properties including effective elastic modulus and Ultimate Tensile Strength (UTS) of all the cycled samples were measured. For each cycling profile, the evolutions of the mechanical properties were characterized as a function of the cycling duration, as well as the net aging time at the high temperature extreme. Comparison of the results of various thermal cycling profiles showed that the detrimental effects of aging are accelerated in a thermal cycling environment. Furthermore, microstructure evolution during thermal cycling has also been investigated to validate the observed mechanical properties degradation. The test results revealed that the mechanical properties degradation of SAC305 are higher in thermal cycling compared to simple equivalent aging. For example, the elastic modulus and UTS of SAC305 reduced by 41%, and 38%, respectively after 5 days aging whereas these properties reduced by 69%, and 51%, respectively after 5 days equivalent aging using thermal cycling profile #4 (240 cycles).

Microstructural evolution of nuclear grade graphite induced by ion irradiation at high temperature environment

2013 ◽  
Vol 434 (1-3) ◽  
pp. 17-23 ◽  
Author(s):  
Shuo-Cheng Tsai ◽  
E-Wen Huang ◽  
Ji-Jung Kai ◽  
Fu-Rong Chen
Keyword(s):  
High Temperature ◽  
Microstructural Evolution ◽  
Ion Irradiation ◽  
Nuclear Grade ◽  
Temperature Environment ◽  
High Temperature Environment

High Temperature Ion-Irradiation Effects on Microstructural Evolution in β-SiC

2003 ◽  
Vol 44 (1) ◽  
pp. 181-185 ◽  
Author(s):  
Sosuke Kondo ◽  
Keyong Hwan Park ◽  
Yutai Katoh ◽  
Akira Kohyama
Keyword(s):  
High Temperature ◽  
Microstructural Evolution ◽  
Ion Irradiation ◽  
Irradiation Effects

Influences of thermal exposure on the microstructural evolution and subsequent mechanical properties of a near-α high temperature titanium alloy

2020 ◽  
Vol 774 ◽  
pp. 138934 ◽  
Author(s):  
Juan Li ◽  
Jianming Cai ◽  
Yaqun Xu ◽  
Wenlong Xiao ◽  
Xu Huang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Titanium Alloy ◽  
High Temperature ◽  
Microstructural Evolution ◽  
Thermal Exposure

Microstructural evolution and mechanical properties of Si3N4–SiC (nanoparticle)–Si3N4 (whisker) composites

2000 ◽  
Vol 15 (2) ◽  
pp. 364-368 ◽  
Author(s):  
Young-Hag Koh ◽  
Hae-Won Kim ◽  
Hyoun-Ee Kim
Keyword(s):  
Mechanical Properties ◽  
Fracture Toughness ◽  
High Temperature ◽  
Flexural Strength ◽  
Microstructural Evolution ◽  
Significant Influence ◽  
The Other ◽  
High Temperature Strength ◽  
Sic Nanoparticles ◽  
Si3n4 Whisker

The effects of SiC-nanoparticle and Si3N4-whisker additions on the microstructural evolution and mechanical properties of Si3N4 were investigated. The addition of SiC nanoparticles suppressed Si3N4 grain growth, leading to an improvement in the flexural strength. On the other hand, Si3N4 whiskers in the specimen promoted the formation of large elongated grains, which were found to be beneficial to the fracture toughness of the material. When both SiC nanoparticles and Si3N4 whiskers were added concurrently, large grains were formed in fine matrix grains. The microstructure of Si3N4 was controlled by adjusting the relative concentrations of SiC nanoparticles and the Si3N4 whiskers added. These compositional and microstructural variations of the Si3N4 had significant influence on the mechanical properties, such as strength, fracture toughness, R-curve behavior, and high-temperature strength.

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