Transient liquid phase bonding of FSX-414 superalloy at the standard heat treatment condition

2012 ◽  
Vol 66 ◽  
pp. 38-45 ◽  
Author(s):  
R. Bakhtiari ◽  
A. Ekrami
Keyword(s):  
Heat Treatment ◽  
Liquid Phase ◽  
Treatment Condition ◽  
Transient Liquid Phase ◽  
Heat Treatment Condition ◽  
Transient Liquid Phase Bonding ◽  
Standard Heat Treatment ◽  
Standard Heat

Long-Time Thermal Structural Stability Study on NiCr20TiAl Alloy

2011 ◽  
Vol 399-401 ◽  
pp. 71-75
Author(s):  
Qiu Ying Yu ◽  
Zhi Shen ◽  
Mai Cang Zhang ◽  
Guo Qing Jia ◽  
Xi Shan Xie
Keyword(s):  
Heat Treatment ◽  
Grain Boundary ◽  
Treatment Condition ◽  
Ostwald Ripening ◽  
Heat Treatment Condition ◽  
Stability Study ◽  
Standard Heat Treatment ◽  
Standard Heat ◽  
Long Time ◽  
Coarsening Kinetics

The coarsening kinetics of main strengthening phase γ′ and the growth behavior of grain boundary carbides have been investigated on NiCr20TiAl alloy aged at 550~750°C for 200~10,000h. The precipitates of NiCr20TiAl alloy at standard heat treatment condition are γ′, M7C3, M23C6 and MC. The coarsening of γ′ precipitates proceeds by Ostwald ripening controlled by volume diffusion in the alloy. Grain boundary carbides M23C6 and M7C3 increase with ageing times and temperatures. The morphologies of precipitates after long-time ageing almost remain the same as that at standard heat treatment condition except 750°C.

Post-bond heat treatment effects on the wide gap transient liquid phase bonding of Inconel 718 with BNi-2 paste filler metal

2019 ◽  
Vol 766 ◽  
pp. 138267 ◽  
Author(s):  
Guangxu Yan ◽  
Ayan Bhowmik ◽  
Balasubramanian Nagarajan ◽  
Xu Song ◽  
Sung Chyn Tan ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Liquid Phase ◽  
Inconel 718 ◽  
Treatment Effects ◽  
Filler Metal ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Wide Gap

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021 ◽  
pp. 095440542098823
Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri
Keyword(s):  
Liquid Phase ◽  
Mechanical Test ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Joint Interface ◽  
Test Results ◽  
X Ray Diffraction ◽  
X Ray ◽  
Metallic Particles ◽  
Powder Interlayer

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

scholarly journals Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

2020 ◽  
Vol 923 ◽  
pp. 012006
Author(s):  
B. Benita ◽  
D.S. Samuvel Prem Kumar ◽  
R. Pravin ◽  
N.Samuel Dinesh Hynes ◽  
J.Angela Jennifa Sujana
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Interlayer Thickness
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