Analysis of temperature effect on isothermal solidification completion time during transient liquid phase bonding

Author(s):  
Oluwadara Caleb Afolabi ◽  
Olanrewaju Akanbi Ojo
2010 ◽  
Vol 97-101 ◽  
pp. 107-110 ◽  
Author(s):  
Si Jie Chen ◽  
Si Jing Guo ◽  
Feng Liang

T91/12Cr2MoWVTiB was bonded by transient liquid phase bonding process with different pressures, one commercial FeNiCrSiB was used as the interlayer. The microstructure and components distribution of the bonded joints were examined by optical microscope and scanning electron microscopic techniques. Furthermore, the properties of the joints were also tested. The results indicate that with the increase of the pressure – from 2 MPa to 6 MPa – the microstructures and mechanical properties were improved, and more similar to those base alloys. A theoretical study also revealed that the isothermal solidification complication time can be shorter, because the maximum liquid width was reduced with the existence of pressure.


Materials ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 769 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Ibrahim Alhoweml ◽  
Muhammad Shar ◽  
Mahmoud Hezam ◽  
Hany Abdo ◽  
...  

Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) after coating both surfaces with zinc. The zinc coatings were applied using the screen printing process of zinc paste. Successful bonds were obtained in a vacuum furnace at 500 °C and under a uniaxial pressure of 1 MPa using high frequency induction heat sintering furnace (HFIHS). Various bonding times were selected and all gave solid joints. The bonds were successfully achieved at 5, 10, 15, 20, 25, and 30 min. The energy dispersive spectroscopy (EDS) line scan confirmed the diffusion of Zn in both sides but with more diffusion in the Mg side. Diffusion of Mg into the joint region was detected with significant amounts at bonds made for 20 min and above, which indicate that the isothermal solidification was achieved. In addition, Ti and Al from the base alloys were diffused into the joint region. Based on microstructural analysis, the joint mechanism was attributed to the formation of solidified mixture of Mg and Zn at the joint region with a presence of diffused Ti and Al. This conclusion was also supported by structural analysis of the fractured surfaces as well as the analysis across the joint region. The fractured surfaces were analyzed and it was concluded that the fractures occurred within the joint region where ductile fractures were observed. The strength of the joint was evaluated by shear test and found that the maximum shear strength achieved was 30.5 MPa for the bond made at 20 min.


2006 ◽  
Vol 45 ◽  
pp. 1588-1593
Author(s):  
Mathieu Brochu ◽  
Fabian Edelmann ◽  
Robin Valin ◽  
Robin A.L. Drew

Transient Liquid Phase Bonding (TLPB) is a joining process that uses liquid as medium for the establishment of an interface between two faying surfaces. In TLPB, as opposed to brazing process, the careful selection of the interlayer materials and the use of a prolonged heat treatment, allows for isothermal solidification and results in interfaces possessing potential service temperature higher than the joining temperature itself. Such a process is attractive for joining ceramics to metals and composites. In this presentation, the applicability of TLPB for various systems: Si3N4/FA-129 iron aluminide alloy, Al2O3/Al2O3, Al-Al2O3/Al-Al2O3, Al-Al2O3/Al-SiC and Al-Al2O3/Al. Results on the interface formation, interfacial microstructure and mechanical properties will be presented. A comparison of the TLPB joint properties with traditional joining for similar systems will be illustrated.


2004 ◽  
Vol 449-452 ◽  
pp. 133-136 ◽  
Author(s):  
Woo Hyuk Choi ◽  
Sung Wook Kim ◽  
Chang Hee Lee ◽  
Jung Cheol Jang

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at 0.1K/sec was nearly the same as heating at 10K/sec.


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