Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings

2012 ◽  
Vol 33 ◽  
pp. 469-475 ◽  
Author(s):  
Kavian O. Cooke ◽  
Tahir I. Khan ◽  
Gossett D. Oliver
Keyword(s):  
Liquid Phase ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Phase Diffusion ◽  
Al 6061

Nanostructured Ni/Al2O3 Interlayer: Transient Liquid Phase Diffusion Bonding of Al6061-MMC

2019 ◽  
Author(s):  
Kavian Cooke ◽  
Tahir Khan
Keyword(s):  
Liquid Phase ◽  
Diffusion Bonding ◽  
Joint Strength ◽  
Transient Liquid Phase ◽  
Weight Ratio ◽  
Bonding Time ◽  
Joint Interface ◽  
Full Potential ◽  
Phase Diffusion ◽  
Alumina Particles

Aluminum metal matrix composites are materials frequently used in the automotive and aerospace industries due to their high strength-to-weight ratio, formability, corrosion resistance, and long-term durability. However, despite the unique properties of these materials, the lack of a reliable joining method has restricted their full potential in engineering applications. This article explores the effect of bonding time on transient liquid phase diffusion bonding of Al6061 containing 15 vol.% alumina particles using a 5 μm electrodeposited Ni-coating containing nano-sized alumina particles as the interlayer. Joint formation was attributed to the solid-state diffusion of Ni into the Al6061 alloy followed by eutectic formation and isothermal solidification at the joint interface. Examination of the joint region using scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction showed the formation of eutectic phases such as Al3Ni, Al9FeNi, and Ni3Si within the joint zone. The results indicate that the addition of nano-size reinforcements into the interlayer can be used to improve joint strength. The joint strength recorded was 136 MPa at a bonding time of 10 min with a marginal increase in the shear strength when the bonding time is increased to 30 min.

Corrosion Behavior of the Transient Liquid Phase Diffusion Bonding Joint of TiNi Shape Memory Alloy and Stainless Steel in Hanks' Solution

2013 ◽  
Vol 750-752 ◽  
pp. 739-742
Author(s):  
Ying Ling Wang ◽  
Qiu Zhi Gao ◽  
Gui Fang Sun ◽  
Jie Ye
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Liquid Phase ◽  
Shape Memory Alloy ◽  
Shape Memory ◽  
Corrosion Behavior ◽  
Pitting Corrosion ◽  
Diffusion Bonding ◽  
Transient Liquid Phase ◽  
Phase Diffusion

The transient liquid phase diffusion bonding (TLP-DB) was employed to join TiNi shape memory alloy (SMA) and stainless steel (SS) with an interlayer metal of Ag-Cu eutectic metal foil.The corrosion behavior of the TLP-DB joint in Hanks solution at 37°C was investigated by electrochemical methods.The results show that the corrosion resistance of the joint is comparable to, but lower than that of base metals during the early anodic polarization, and the corrosion rate of the joint is between that of TiNi SMA and SS in the transpassive region at high potentials. The corrosion resistance of the specimens in Hanks' solution is associated with the surface quality, mircotructure and the intermetallics. Both TiNi SMA and SS display the characteristics of localized corrosion with a little pitting corrosion, while the joints mainly show the characteristics of pitting corrosion concentrated on the enrichment Cu phases.

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