Numerical investigation of Directional Solidification process for improving multi-crystalline silicon ingot quality for photovoltaic applications

2019 ◽  
Vol 241 ◽  
pp. 180-183 ◽  
Author(s):  
V. Kesavan ◽  
M. Srinivasan ◽  
P. Ramasamy
2011 ◽  
Vol 189-193 ◽  
pp. 1476-1481
Author(s):  
Kun Liu ◽  
Zhe Wang ◽  
Ren Zhi Han ◽  
Zi Ping Ren

By using Fluent software, the mathematical model of temperature field is established on directional solidification process for large-scale frustum of a cone ingot, and the result is analyzed by Origin software, Tecplot. The influences of different width/thickness ratio to directional solidification process of cone ingot are discussed in order to provide basis for design optimization and ingot quality improvement.


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