Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

2021 ◽  
pp. 131074
Author(s):  
Han Jiang ◽  
Stuart Robertson ◽  
Shuibao Liang ◽  
Zhaoxia Zhou ◽  
Liguo Zhao ◽  
...  
Talanta ◽  
2021 ◽  
Vol 221 ◽  
pp. 121643 ◽  
Author(s):  
B. Patella ◽  
R.R. Russo ◽  
A. O'Riordan ◽  
G. Aiello ◽  
C. Sunseri ◽  
...  

2017 ◽  
Vol 27 (3) ◽  
pp. 311-315 ◽  
Author(s):  
Hanqing Zhang ◽  
Yining Wang ◽  
Xuesen Gao ◽  
Zhuo Gao ◽  
Yan Chen

Coatings ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 272
Author(s):  
Mehmet F. Cansizoglu ◽  
Mesut Yurukcu ◽  
Tansel Karabacak

Chemical removal of materials from the surface is a fundamental step in micro- and nano-fabrication processes. In conventional plasma etching, etchant molecules are non-directional and perform a uniform etching over the surface. However, using a highly directional obliquely incident beam of etching agent, it can be possible to engineer surfaces in the micro- or nano- scales. Surfaces can be patterned with periodic morphologies like ripples and mounds by controlling parameters including the incidence angle with the surface and sticking coefficient of etching particles. In this study, the dynamic evolution of a rippled morphology has been investigated during oblique angle etching (OAE) using Monte Carlo simulations. Fourier space and roughness analysis were performed on the resulting simulated surfaces. The ripple formation was observed to originate from re-emission and shadowing effects during OAE. Our results show that the ripple wavelength and root-mean-square roughness evolved at a more stable rate with accompanying quasi-periodic ripple formation at higher etching angles (θ > 60°) and at sticking coefficient values (Sc) 0.5 ≤ Sc ≤ 1. On the other hand, smaller etching angle (θ < 60°) and lower sticking coefficient values lead to a rapid formation of wider and deeper ripples. This result of this study can be helpful to develop new surface patterning techniques by etching.


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Yongmeng Wu ◽  
Cuibo Liu ◽  
Changhong Wang ◽  
Yifu Yu ◽  
Yanmei Shi ◽  
...  

AbstractElectrocatalytic alkyne semi-hydrogenation to alkenes with water as the hydrogen source using a low-cost noble-metal-free catalyst is highly desirable but challenging because of their over-hydrogenation to undesired alkanes. Here, we propose that an ideal catalyst should have the appropriate binding energy with active atomic hydrogen (H*) from water electrolysis and a weaker adsorption with an alkene, thus promoting alkyne semi-hydrogenation and avoiding over-hydrogenation. So, surface sulfur-doped and -adsorbed low-coordinated copper nanowire sponges are designedly synthesized via in situ electroreduction of copper sulfide and enable electrocatalytic alkyne semi-hydrogenation with over 99% selectivity using water as the hydrogen source, outperforming a copper counterpart without surface sulfur. Sulfur anion-hydrated cation (S2−-K+(H2O)n) networks between the surface adsorbed S2− and K+ in the KOH electrolyte boost the production of active H* from water electrolysis. And the trace doping of sulfur weakens the alkene adsorption, avoiding over-hydrogenation. Our catalyst also shows wide substrate scopes, up to 99% alkenes selectivity, good reducible groups compatibility, and easily synthesized deuterated alkenes, highlighting the promising potential of this method.


ACS Photonics ◽  
2021 ◽  
Author(s):  
Anjan Mukherjee ◽  
Dingding Ren ◽  
Per-Erik Vullum ◽  
Junghwan Huh ◽  
Bjørn-Ove Fimland ◽  
...  

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