Infrared thermographic investigation of the use of microcrystalline wax to preserve apples from thermal shocks

Measurement ◽  
2020 ◽  
Vol 152 ◽  
pp. 107304 ◽  
Author(s):  
Rosario Morello ◽  
Claudio De Capua
Aquaculture ◽  
2007 ◽  
Vol 272 ◽  
pp. S276
Author(s):  
A. Kettunen ◽  
G. Kauric ◽  
S. Peruzzi

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.


2014 ◽  
Vol 51 (6) ◽  
pp. 1311-1321 ◽  
Author(s):  
Guian Qian ◽  
V.F. Gonzalez-Albuixech ◽  
Markus Niffenegger

Author(s):  
Jean-Philippe Mathieu ◽  
Jean-Franc¸ois Rit ◽  
Je`roˆme Ferrari ◽  
David Hersant

Most safety related valves in EDF’s nuclear plant must prove their ability to sustain thermal shocks of approximately 240K amplitude. This paper evaluates the simulation of a globe valve tested for thermal shocks. Since the physical test campaign showed inadequate internal sealing, the simulation focuses on the residual deformation of the hard alloy, planar seat, welded on successive body designs. This deformation is the result of the thermal loadings first induced by the welding process, then by fluid flow inside the valve. A chain of 3D simulations successively computes: a welding temperature transient in the body, the resulting strain hardening — especially in the seat vicinity —; temperature transients in the flow and the valve parts, and the resulting strains in the body causing a bump deformation of the seat surface. This end result agrees with measurements on the tested valve specimen. We show that inaccurate results are obtained on simpler assumptions, such as no welding, and we give insights on the dominant effect of the first hot, cold, hot transient over other profiles. Finally, the agreement we obtain on deformation predictions is toned down by an unsatisfactory sealing prediction, as well as the complexity and duration of the simulation chain compared with physical testing.


1965 ◽  
Vol 18 (6) ◽  
pp. 777-783
Author(s):  
N. S. Martynova ◽  
I. V. Vasil'kova ◽  
M. P. Susarev

2014 ◽  
Vol 112 (1) ◽  
Author(s):  
Blaise Bourdin ◽  
Jean-Jacques Marigo ◽  
Corrado Maurini ◽  
Paul Sicsic
Keyword(s):  

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