A high-efficiency multi-beam splitter for optical pickups using ultra-precision manufacturing

2014 ◽  
Vol 113 ◽  
pp. 74-79 ◽  
Author(s):  
Jo-Han Hsu ◽  
Chi-Hung Lee ◽  
Rongshun Chen
2021 ◽  
Vol 8 (2) ◽  
pp. 021303
Author(s):  
Mikel Larrañaga-Altuna ◽  
Alaitz Zabala ◽  
Iñigo Llavori ◽  
Oliver Pearce ◽  
Dinh T. Nguyen ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3184
Author(s):  
Jing Li ◽  
Yonggang He ◽  
Han Ye ◽  
Tiesheng Wu ◽  
Yumin Liu ◽  
...  

Metasurface-based beam splitters attracted huge interest for their superior properties compared with conventional ones made of bulk materials. The previously reported designs adopted discrete metasurfaces with the limitation of a discontinuous phase profile. In this paper, we propose a dual-band beam splitter, based on an anisotropic quasi-continuous metasurface, by exploring the optical responses under x-polarized (with an electric field parallel to the direction of the phase gradient) and y-polarized incidences. The adopted metasurface consists of two identical trapezoidal silicon antenna arrays with opposite spatial variations that lead to opposite phase gradients. The operational window of the proposed beam splitter falls in the infrared and visible region, respectively, for x- and y-polarized light, resulting from the different mechanisms. When x-polarized light is incident, the conversion efficiency and total transmission of the beam splitter remains higher than 90% and 0.74 within the wavelength range from 969 nm to 1054 nm, respectively. In this condition, each array can act as a beam splitter of unequal power. For y-polarized incidence, the maximum conversion efficiency and transmission reach approximately 100% and 0.85, while the values remain higher than 90% and 0.65 in the wavelength range from 687 nm to 710 nm, respectively. In this case, each array can be viewed as an effective beam deflector. We anticipate that it can play a key role in future integrated optical devices.


2014 ◽  
Vol 625 ◽  
pp. 489-495
Author(s):  
Ling Bao Kong ◽  
Ji Bin Li ◽  
Chi Fai Cheung ◽  
Yan Lou ◽  
Chang Sheng Wang ◽  
...  

This paper presents an integrated roller embossing process named Continuous Injection Direct Rolling (CIDR) process. The CIDR process is similar to Continue Casting Direct Rolling (CCDR) process for metal material. The process consists of Plastic Injection Module, Injection Nozzle, Precision Rolling Module, and Automatic Coiling Module. In the proposed CIDR process, the plastic plate with microstructured pattern is produced by the integrated injection and rolling process, which is different from the current rolling or plastic injection process. Some key technologies including injection nozzle design, roller design, roller coupling, and ultra-precision machining of rollers, are presented. An on-machine measurement method is also proposed and presented to avoid the incontinence and errors caused by disassembling the roller workpiece for off-line measurement. The results of the pilot study are also discussed. The research work provides an enabling solution for precision manufacturing plastic plate and film with microstructured patterns.


2018 ◽  
Vol 20 (12) ◽  
pp. 125002 ◽  
Author(s):  
Lujun Hong ◽  
Sanshui Xiao ◽  
Xiaohua Deng ◽  
Rongqiang Pu ◽  
Linfang Shen

2020 ◽  
Vol 14 (4) ◽  
pp. 654-664 ◽  
Author(s):  
Kodai Nagayama ◽  
◽  
Jiwang Yan

In ultra-precision diamond turning of freeform optics, it is necessary to obtain submicron-level form accuracy with high efficiency. In this study, we proposed a new method for the quick measurement and compensation of tool contour errors to improve the form accuracy of the workpiece. In this method, the nanometer-scale contour error of a diamond tool is quickly and precisely measured using a white light interferometer and then compensated for, before machining. Results showed that the contour of a diamond tool was measured with an error less than 0.05 μm peak-to-valley (P-V) and the feasibility of error compensation was verified through cutting experiments to create a paraboloid mirror and a microlens array. The form error decreased to 0.2 μm P-V regardless of the contour error of the diamond tools when cutting the paraboloid mirror, and that of the microlens array was reduced to 0.15 μm P-V during a single machining step.


2013 ◽  
Vol 797 ◽  
pp. 667-672 ◽  
Author(s):  
Peng Yao ◽  
Wei Wang ◽  
Chuan Zhen Huang ◽  
Jun Wang ◽  
Hong Tao Zhu ◽  
...  

To provide a fundamental knowledge for the high efficiency grinding and ultra-precision grinding of fused silica, ductile mode and brittle mode material removal mechanisms were investigated by conducting micro/nanoindentation experiments in the range of 4.9 mN - 1960 mN. Before observing cracks and determining the ductile to brittle transition penetration depth, the samples were etched with hydrofluoric acid to expose cracks. The typical damage morphology of fused silica was discussed by observing the surface and cross-section of indentations, and the depth of SSD was found to be determined by the cone cracks or borderline cracks in the different load range. The ductile to brittle transition penetration depth of fused silica under Vickers indentation was 180 nm.


2021 ◽  
Author(s):  
Chao Xu ◽  
Hao Hu ◽  
Xiaoqiang Peng ◽  
Tao Lai ◽  
Jiahui Bao

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