Mesoporous MFI zeolite material from silica–alumina/epoxy-resin composite material and its catalytic activity

A silicon dioxide–copper (SiO2-Cu) epoxy resin composite material for chip packaging was made by a mechanical mixing method with epoxy resin as the base glue and SiO2 coated with nano-Cu (SiO2-Cu) particles as the filler. The dispersion of SiO2-Cu nanoparticles in epoxy resin was studied using scanning electron microscopy and transmission electron microscopy. Meanwhile, the effects of the filler on the coefficient of thermal conductivity, the coefficient of thermal expansion (CTE), and the mechanical properties of the composite material were also studied. The results show that SiO2-Cu nanoparticles disperse well in the epoxy resin, the coefficient of thermal conductivity of SiO2-Cu epoxy resin composites increases with an increase in the SiO2-Cu filler amount, the coefficient of thermal conductivity begins to decline when the filling volume is over 25%, and the suitable amount of SiO2-Cu is 25% of the total volume. With the increase in the filler, the CTE of the composite decreases; when the SiO2-Cu filling amount is 25%, the material has good impact resistance and a long electromigration failure time for chip packaging materials.

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Critical temperature estimation method for triple-walled carbon nanotubes (CNTs)/epoxy resin composite material

Journal of Chemical Engineering and Materials Science ◽

10.5897/jcems2018.0324 ◽

2018 ◽

Vol 9 (3) ◽

pp. 24-30

Author(s):

Anvari A.

Keyword(s):

Carbon Nanotubes ◽

Composite Material ◽

Critical Temperature ◽

Epoxy Resin ◽

Resin Composite ◽

Estimation Method ◽

Temperature Estimation ◽

Epoxy Resin Composite ◽

Walled Carbon Nanotubes

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Study and Analyze of Wear Behavior Carbon Nano Tube-Epoxy Resin Composite Material

International Journal for Research in Applied Science and Engineering Technology ◽

10.22214/ijraset.2017.11059 ◽

2017 ◽

Vol V (XI) ◽

pp. 394-401

Author(s):

Mohammad Giyahudeen .R

Keyword(s):

Composite Material ◽

Epoxy Resin ◽

Wear Behavior ◽

Resin Composite ◽

Epoxy Resin Composite ◽

Carbon Nano Tube

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Study on the Effects of Diluent on Silica/Epoxy Resin Composite Material Phase Change

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.459.34 ◽

2013 ◽

Vol 459 ◽

pp. 34-39 ◽

Cited By ~ 1

Author(s):

Huey Ling Chang ◽

Chih Ming Chen ◽

Kung Liang Lin ◽

Bor Kae Chang

Keyword(s):

Composite Material ◽

Glass Transition ◽

Thermal Properties ◽

Transition Temperature ◽

Epoxy Resin ◽

Resin Composite ◽

Processing Conditions ◽

Post Processing ◽

Optimal Processing ◽

Epoxy Resin Composite

This study investigates the resulting nanocomposite material formed by hot-forming and molding epoxy resin containing diluent, nanosilica powder, and hardener. The effects of different processing conditions on the composite material, such as post-processing, nanopowder content, thinner amount, etc. The optimal processing conditions can be discovered by analyzing samples with a differential scanning calorimeter (DSC) to discern the glass transition temperature (Tg). Experimental results show that without post-processing, the composite material would not have enough reaction time, and that without thinner, the sample containing 1 wt% nanopowder had the highest Tg. The addition of thinner lowers the Tg of a sample, leading to reduced thermal properties.

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