Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Abstract Cooperative or concurrent product development is gaining popularity and will become norms of the Industry of the Future. To avoid problem created by designs not amenable to manufacturing, the designer should be aware of manufacturing constraints. Electronics manufacturing is one of the fastest growing segment of manufacturing domain today. The rapid change in the manufacturing of printed wiring boards with the induction of surface mounted components makes the system design more complex. To capture the manufacturability constraints of the manufacturing of printed wiring boards (printed wiring board is another name of printed circuit boards), a knowledge-base is developed to assist the designer. Rules and guidelines pertaining to manufacturability are formulated and incorporated into the knowledge-base. The implementation of the meta-level knowledge to increase the efficiency of the system is also presented. The system is developed using an object-oriented paradigm and capable of suggesting design modification to the designer at the early stage of design to eliminate the manufacturing problems in the later phase of board production. The broad user interface makes the system very user friendly.

Space Dependence of Divided Ground Patterns on FM-Band Cross-Talk Characteristics between Two Parallel Signal Traces on Printed Circuit Boards for Vehicles

IEEJ Transactions on Electronics Information and Systems ◽

10.1541/ieejeiss.132.1897 ◽

2012 ◽

Vol 132 (12) ◽

pp. 1897-1903 ◽

Cited By ~ 2

Author(s):

Michihira Iida ◽

Tsuyoshi Maeno ◽

Jianqing Wang ◽

Osamu Fujiwara

Keyword(s):

Cross Talk ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Space Dependence

An Evaluation Method on Effect of Geometrical Configuration to FM-Band Cross-Talk Characteristics between Two Parallel Signal Traces including their Divided Ground Patterns on Printed Circuit Boards for Vehicles

10.1541/ieejfms.135.9 ◽

2015 ◽

Vol 135 (1) ◽

pp. 9-16

Author(s):

Michihira Iida ◽

Tsuyoshi Maeno ◽

Jianqing Wang ◽

Osamu Fujiwara

Keyword(s):

Cross Talk ◽

Printed Circuit Boards ◽

Evaluation Method ◽

Geometrical Configuration ◽

Circuit Boards ◽

Effect of Water Absorption Temperature on Space Charge Profiles in Paper/phenol-resin Composites for Printed Circuit Boards

10.1541/ieejfms.128.585 ◽

2008 ◽

Vol 128 (9) ◽

pp. 585-590 ◽

Cited By ~ 5

Author(s):

Yasutsune Echigo ◽

Masashi Natsui ◽

Takashi Maeno ◽

Yoshimichi Ohki

Keyword(s):

Space Charge ◽

Water Absorption ◽

Printed Circuit Boards ◽

Resin Composites ◽

Circuit Boards ◽

Phenol Resin ◽

Printed Circuit ◽

Effect Of Water

Reduction Characteristics of FM-Band Cross-Talks between Two Parallel Signal Traces on Printed Circuit Boards for Vehicles

10.1541/ieejfms.129.357 ◽

2009 ◽

Vol 129 (5) ◽

pp. 357-362 ◽

Cited By ~ 3

Author(s):

Tsuyoshi Maeno ◽

Hiroya Ueyama ◽

Michihira Iida ◽

Osamu Fujiwara

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Reduction Characteristics

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

10.1541/ieejfms.128.657 ◽

2008 ◽

Vol 128 (11) ◽

pp. 657-662 ◽

Cited By ~ 6

Author(s):

Tsuyoshi Maeno ◽

Yukihiko Sakurai ◽

Takanori Unou ◽

Kouji Ichikawa ◽

Osamu Fujiwara

Keyword(s):

Cross Talk ◽

Printed Circuit Boards ◽

Common Ground ◽

Circuit Boards ◽

Laser dicing of electronics printed circuit boards using a DPSS UV Nd:YVO4 laser

International Congress on Applications of Lasers & Electro-Optics ◽

10.2351/1.5061216 ◽

2007 ◽

Author(s):

X. C. Wang ◽

Z. L. Li ◽

T. Chen ◽

K. H. L. Li ◽

B. K. Lok ◽

...

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

Proceedings of Universities ELECTRONICS ◽

10.24151/1561-5405-2018-23-2-141-148 ◽

2018 ◽

Vol 23 (2) ◽

pp. 141-148

Author(s):

S.Sh. Rekhviashvili ◽

◽

M.O. Mamchuev ◽

V.V. Narozhnov ◽

M.M. Oshkhunov ◽

...

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

Bulletin of the Polish Academy of Sciences Technical Sciences ◽

10.2478/bpasts-2013-0078 ◽

2013 ◽

Vol 61 (3) ◽

pp. 731-735

Author(s):

A.W. Stadler ◽

Z. Zawiślak ◽

W. Stęplewski ◽

A. Dziedzic

Keyword(s):

Thin Film ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Noise Component ◽

Printed Circuit ◽

Resistance Bridge ◽

Different Types ◽

Signal Path ◽

Resistance Fluctuations ◽

Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.